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1. WO2020222454 - THICKNESS MEASURING DEVICE

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Publication Number WO/2020/222454
Publication Date 05.11.2020
International Application No. PCT/KR2020/005265
International Filing Date 21.04.2020
IPC
G01B 15/02 2006.01
GPHYSICS
01MEASURING; TESTING
BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
15Measuring arrangements characterised by the use of wave or particle radiation
02for measuring thickness
G01D 1/12 2006.01
GPHYSICS
01MEASURING; TESTING
DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED BY A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; TRANSFERRING OR TRANSDUCING ARRANGEMENTS NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
1Measuring arrangements giving results other than momentary value of variable, of general application
12giving a maximum or minimum of a value
G05D 27/02 2006.01
GPHYSICS
05CONTROLLING; REGULATING
DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
27Simultaneous control of variables covered by two or more of main groups G05D1/-G05D25/124
02characterised by the use of electric means
Applicants
  • 한양대학교 산학협력단 INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY [KR]/[KR]
Inventors
  • 김학성 KIM, Hak Sung
  • 오경환 OH, Gyung Hwan
  • 박동운 PARK, Dong Woon
  • 김헌수 KIM, Heon Su
Agents
  • 특허법인 아이피에스 IPS PATENT FIRM
Priority Data
10-2019-005066030.04.2019KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) THICKNESS MEASURING DEVICE
(FR) DISPOSITIF DE MESURE D’ÉPAISSEUR
(KO) 두께 측정 장치
front page image
Abstract
(EN)
A thickness measuring device of the present invention comprises: a supporter for supporting a specimen; an emission unit for emitting an electromagnetic wave toward the specimen; a chamber for encompassing the specimen; a receiving unit for receiving the electromagnetic wave outputted in the direction in which the chamber is positioned; and a control unit for calculating the thickness of the specimen by receiving a signal from the receiving unit. At least one area of the chamber transmits a part of the electromagnetic wave and reflects the remaining part thereof. The receiving unit receives a first electromagnetic wave having a first peak and receives a second electromagnetic wave having a second peak, the first peak indicates a first point of time and the second peak indicates a second point of time, and the first point of time and the second point of time have a difference that is greater than or equal to a first period.
(FR)
L'invention concerne un dispositif de mesure d'épaisseur comprenant : un support pour supporter un échantillon ; une unité d'émission pour émettre une onde électromagnétique vers l'échantillon ; une chambre pour englober l'échantillon ; une unité de réception pour recevoir l'onde électromagnétique émise dans la direction dans laquelle la chambre est positionnée ; et une unité de commande pour calculer l'épaisseur de l'échantillon par réception d'un signal provenant de l'unité de réception. Au moins une zone de la chambre transmet une partie de l'onde électromagnétique et réfléchit la partie restante de celle-ci. L'unité de réception reçoit une première onde électromagnétique ayant un premier pic et reçoit une seconde onde électromagnétique ayant un second pic, le premier pic indiquant un premier instant et le second pic indiquant un second instant, et le premier instant et le second instant ayant une différence qui est supérieure ou égale à une première période.
(KO)
본 발명의 두께 측정 장치는 시편을 지지하는 서포터, 전자기파를 상기 시편 방향으로 조사하는 방출부, 상기 시편을 둘러싸는 챔버, 상기 챔버가 위치하는 방향에서부터 출력되는 전자기파를 수신하는 수신부 및 상기 수신부로부터 신호를 받아 상기 시편의 두께를 산출하는 제어부를 포함한다. 상기 챔버의 적어도 일영역은 상기 전자기파의 일부는 투과시키고 나머지 일부는 반사시킨다. 상기 수신부는 제1 피크를 가지는 제1 전자기파 및 제2 피크를 가지는 제2 전자기파를 수신하고, 상기 제1 피크는 제1 시점에서 나타나고, 상기 제2 피크는 제2 시점에서 나타나며, 상기 제1 시점과 상기 제2 시점은 제1 기간 이상의 차이를 가진다.
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