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1. WO2020220268 - THREE-DIMENSIONAL MEMORY DEVICE HAVING BENT BACKSIDE WORD LINES

Publication Number WO/2020/220268
Publication Date 05.11.2020
International Application No. PCT/CN2019/085210
International Filing Date 30.04.2019
IPC
H01L 27/11582 2017.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
04the substrate being a semiconductor body
10including a plurality of individual components in a repetitive configuration
105including field-effect components
112Read-only memory structures
115Electrically programmable read-only memories; Multistep manufacturing processes therefor
11563with charge-trapping gate insulators, e.g. MNOS or NROM
11578characterised by three-dimensional arrangements, e.g. with cells on different height levels
1158with source and drain on different levels, e.g. with sloping channels
11582the channels comprising vertical portions, e.g. U-shaped channels
CPC
H01L 27/11524
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
04the substrate being a semiconductor body
10including a plurality of individual components in a repetitive configuration
105including field-effect components
112Read-only memory structures ; [ROM] and multistep manufacturing processes therefor
115Electrically programmable read-only memories; Multistep manufacturing processes therefor
11517with floating gate
11521characterised by the memory core region
11524with cell select transistors, e.g. NAND
H01L 27/11529
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
04the substrate being a semiconductor body
10including a plurality of individual components in a repetitive configuration
105including field-effect components
112Read-only memory structures ; [ROM] and multistep manufacturing processes therefor
115Electrically programmable read-only memories; Multistep manufacturing processes therefor
11517with floating gate
11526characterised by the peripheral circuit region
11529of memory regions comprising cell select transistors, e.g. NAND
H01L 27/11551
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
04the substrate being a semiconductor body
10including a plurality of individual components in a repetitive configuration
105including field-effect components
112Read-only memory structures ; [ROM] and multistep manufacturing processes therefor
115Electrically programmable read-only memories; Multistep manufacturing processes therefor
11517with floating gate
11551characterised by three-dimensional arrangements, e.g. with cells on different height levels
H01L 27/11556
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
04the substrate being a semiconductor body
10including a plurality of individual components in a repetitive configuration
105including field-effect components
112Read-only memory structures ; [ROM] and multistep manufacturing processes therefor
115Electrically programmable read-only memories; Multistep manufacturing processes therefor
11517with floating gate
11551characterised by three-dimensional arrangements, e.g. with cells on different height levels
11553with source and drain on different levels, e.g. with sloping channels
11556the channels comprising vertical portions, e.g. U-shaped channels
H01L 27/1157
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
04the substrate being a semiconductor body
10including a plurality of individual components in a repetitive configuration
105including field-effect components
112Read-only memory structures ; [ROM] and multistep manufacturing processes therefor
115Electrically programmable read-only memories; Multistep manufacturing processes therefor
11563with charge-trapping gate insulators, e.g. MNOS or NROM
11568characterised by the memory core region
1157with cell select transistors, e.g. NAND
H01L 27/11573
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
04the substrate being a semiconductor body
10including a plurality of individual components in a repetitive configuration
105including field-effect components
112Read-only memory structures ; [ROM] and multistep manufacturing processes therefor
115Electrically programmable read-only memories; Multistep manufacturing processes therefor
11563with charge-trapping gate insulators, e.g. MNOS or NROM
11573characterised by the peripheral circuit region
Applicants
  • YANGTZE MEMORY TECHNOLOGIES CO., LTD. [CN]/[CN]
Inventors
  • XIAO, Li Hong
Agents
  • NTD UNIVATION INTELLECTUAL PROPERTY AGENCY LTD.
Priority Data
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) THREE-DIMENSIONAL MEMORY DEVICE HAVING BENT BACKSIDE WORD LINES
(FR) DISPOSITIF DE MÉMOIRE TRIDIMENSIONNEL AYANT DES LIGNES DE MOTS ARRIÈRE COURBÉES
Abstract
(EN)
A three-dimensional (3D) memory device having bent backside word lines is disclosed. The 3D memory device includes a substrate (102), a semiconductor layer (104) above and extending laterally beyond at least one edge (114, 116) of the substrate (102), a plurality of interleaved conductive layers (110) and dielectric layers (112) above a front side of the semiconductor layer (104) and extending below a back side of the semiconductor layer (104), and a plurality of memory strings (130, 140) each extending vertically through the interleaved conductive layers (110) and dielectric layers (112) and in contact with the semiconductor layer (104).
(FR)
L'invention concerne un dispositif de mémoire tridimensionnel (3D) ayant des lignes de mots arrière courbées. Le dispositif de mémoire 3D comprend un substrat (102), une couche semi-conductrice (104) au-dessus et s'étendant latéralement au-delà d'au moins un bord (114, 116) du substrat (102), une pluralité de couches conductrices entrelacées (110) et des couches diélectriques (112) au-dessus d'un côté avant de la couche semi-conductrice (104) et s'étendant au-dessous d'un côté arrière de la couche semi-conductrice (104), et une pluralité de chaînes de mémoire (130, 140) s'étendant chacune verticalement à travers les couches conductrices entrelacées (110) et les couches diélectriques (112) et en contact avec la couche semi-conductrice (104).
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