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1. WO2020208968 - TWO-SIDE POLISHING DEVICE

Publication Number WO/2020/208968
Publication Date 15.10.2020
International Application No. PCT/JP2020/007912
International Filing Date 27.02.2020
IPC
B24B 37/005 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
005Control means for lapping machines or devices
B24B 37/08 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
04designed for working plane surfaces
07characterised by the movement of the work or lapping tool
08for double side lapping
B24B 37/12 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
11Lapping tools
12Lapping plates for working plane surfaces
B24B 37/14 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
11Lapping tools
12Lapping plates for working plane surfaces
14characterised by the composition or properties of the plate materials
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
Applicants
  • 信越半導体株式会社 SHIN-ETSU HANDOTAI CO., LTD. [JP]/[JP]
  • 不二越機械工業株式会社 FUJIKOSHI MACHINERY CORP. [JP]/[JP]
Inventors
  • 田中 佑宜 TANAKA Yuki
  • 丸田 将史 MARUTA Masashi
Agents
  • 好宮 幹夫 YOSHIMIYA Mikio
  • 小林 俊弘 KOBAYASHI Toshihiro
Priority Data
2019-07564811.04.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) TWO-SIDE POLISHING DEVICE
(FR) DISPOSITIF DE POLISSAGE À DEUX CÔTÉS
(JA) 両面研磨装置
Abstract
(EN)
The present invention is a two-side polishing device equipped with: a lower platen that is provided so as to be rotatable about a rotating shaft and that has a polishing pad affixed to an upper surface thereof; an upper platen that is provided above the lower platen so as to be movable up and down and rotatable about the rotating shaft and that has a polishing pad affixed to a lower surface thereof; and a suspended top that is provided above the upper platen. The two-side polishing device is characterized by comprising: a connecting part that connects the suspended top and the upper platen; and an actuator that is provided between the suspended top and the upper platen, in a position different from the connecting part, and that is capable of deforming the shape of the upper platen. Due to this configuration, a platen moving mechanism is provided that enables the shape of a platen to be deformed into various shapes without promoting thermal deformation of the platen in a duplex polishing device in a suspended state.
(FR)
La présente invention concerne un dispositif de polissage à deux côtés équipé : d'un plateau inférieur qui est disposé de manière à pouvoir tourner autour d'un arbre rotatif et qui présente un tampon de polissage fixé à une surface supérieure de celui-ci ; d'un plateau supérieur qui est disposé au-dessus du plateau inférieur de manière à être mobile vers le haut et vers le bas et rotatif autour de l'arbre rotatif et qui présente un tampon de polissage fixé à une surface inférieure de celui-ci ; et d'un sommet suspendu qui est disposé au-dessus du plateau supérieur. Le dispositif de polissage à deux côtés est caractérisé en ce qu'il comprend : une partie de raccordement qui raccorde le sommet suspendu au plateau supérieur ; et un actionneur qui est disposé entre le sommet suspendu et le plateau supérieur, dans une position différente de la partie de raccordement, et qui est capable de déformer la forme du plateau supérieur. Grâce à cette configuration, un mécanisme de déplacement de plateau est fourni, qui permet de déformer la forme d'un plateau sous diverses formes sans favoriser une déformation thermique du plateau dans un dispositif de polissage en duplex dans un état suspendu.
(JA)
本発明は、回転軸を中心に回転可能に設けられ、上面に研磨パッドが貼り付けられた下定盤と、前記下定盤の上方に上下動可能、かつ前記回転軸を中心に回転可能に設けられ、下面に研磨パッドが貼り付けられた上定盤と、前記上定盤の上方に設けられる吊り天板とを具備する両面研磨装置において、前記吊り天板と前記上定盤とを連結する連結部と、前記吊り天板と前記上定盤との間であって前記連結部と異なる位置に設けられ、上定盤形状を変形可能なアクチュエータとを具備することを特徴とする両面研磨装置である。これにより、吊り下げ形態の両面研磨装置において、定盤の熱変形を助長せず、かつ定盤形状を様々な形に変形可能な定盤の可動機構が提供される。
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