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1. WO2020205580 - PANEL OF LIGHT-EMITTING DIODE (LED) ARRAYS COMPRISING A PLURALITY OF BACKPLANES EMBEDDED IN THE SUBSTRATE AND LIGHT-EMITTING DIODE (LED) LIGHTING SYSTEM COMPRISING BACKPLANE EMBEDDED IN THE SUBSTRATE

Publication Number WO/2020/205580
Publication Date 08.10.2020
International Application No. PCT/US2020/025376
International Filing Date 27.03.2020
IPC
H01L 25/075 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/78
H01L 27/15 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
15including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
H01L 33/62 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H01L 33/64 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
64Heat extraction or cooling elements
CPC
H01L 2021/60067
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
60Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
60007involving a soldering or an alloying process
60022using bump connectors, e.g. for flip chip mounting
60067Aligning the bump connectors with the mounting substrate
H01L 2021/60135
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
60Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
60007involving a soldering or an alloying process
60022using bump connectors, e.g. for flip chip mounting
60097Applying energy, e.g. for the soldering or alloying process
60135using convection, e.g. reflow oven
H01L 21/4853
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
4814Conductive parts
4846Leads on or in insulating or insulated substrates, e.g. metallisation
4853Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
H01L 21/486
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
4814Conductive parts
4846Leads on or in insulating or insulated substrates, e.g. metallisation
486Via connections through the substrate with or without pins
H01L 21/6836
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
6835using temporarily an auxiliary support
6836Wafer tapes, e.g. grinding or dicing support tapes
H01L 21/76805
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
71Manufacture of specific parts of devices defined in group H01L21/70
768Applying interconnections to be used for carrying current between separate components within a device ; comprising conductors and dielectrics
76801characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
76802by forming openings in dielectrics
76805the opening being a via or contact hole penetrating the underlying conductor
Applicants
  • LUMILEDS LLC [US]/[US]
Inventors
  • HIN, Tze Yang
  • XUE, Qing
Agents
  • KERNER, Dawn C.
Priority Data
16/831,37826.03.2020US
62/826,61229.03.2019US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PANEL OF LIGHT-EMITTING DIODE (LED) ARRAYS COMPRISING A PLURALITY OF BACKPLANES EMBEDDED IN THE SUBSTRATE AND LIGHT-EMITTING DIODE (LED) LIGHTING SYSTEM COMPRISING BACKPLANE EMBEDDED IN THE SUBSTRATE
(FR) PANNEAU DE RÉSEAUX DE DIODES ÉLECTROLUMINESCENTES (DEL) COMPRENANT UNE PLURALITÉ DE FONDS DE PANIER INTÉGRÉS DANS LE SUBSTRAT ET SYSTÈME D'ÉCLAIRAGE À DIODES ÉLECTROLUMINESCENTES (DEL) COMPRENANT UN FOND DE PANIER INTÉGRÉ DANS LE SUBSTRAT
Abstract
(EN)
Panels (200) of LED arrays (240) and LED lighting systems are described. A panel (200) includes a substrate (212) having a top (210) and a bottom (214) surface. Multiple backplanes (220) are embedded in the substrate (212), each having a top (222) and a bottom (224) surface. Multiple first electrically conductive structures (226) extend at least from the top surface (222) of each of the backplanes (220) to the top surface (210) of the substrate (212). Each of multiple LED arrays (240) is electrically coupled to at least some of the first conductive structures (226). Multiple second conductive structures (228, 229) extend from each of the backplanes (220) to at least the bottom surface (214) of the substrate (212). At least some of the second electrically conductive structures (228, 229) are coupled to at least some of the first electrically conductive structures (226) via the backplane (220). A thermal conductive structure (230) is in contact with the bottom surface (224) of each of the backplanes (220) and extends to at least the bottom surface (214) of the substrate (212).
(FR)
L'invention concerne des panneaux (200) de réseaux de DEL (240) et des systèmes d'éclairage à DEL. Un panneau (200) comprend un substrat (212) ayant une surface supérieure (210) et une surface inférieure (214). De multiples fonds de panier (220) sont intégrés dans le substrat (212), chacun ayant une surface supérieure (222) et une surface inférieure (224). De multiples premières structures électriquement conductrices (226) s'étendent au moins à partir de la surface supérieure (222) de chacun des fonds de panier (220) jusqu'à la surface supérieure (210) du substrat. Chacun de multiples réseaux de DEL (240) est couplé électriquement à au moins certaines des premières structures conductrices (226). De multiples secondes structures conductrices (228, 229) s'étendent à partir de chacun des fonds de panier (220) jusqu'à au moins la surface inférieure (214) du substrat (212). Au moins certaines des secondes structures électriquement conductrices (228, 229) sont couplées à au moins certaines des premières structures électriquement conductrices (226) par l'intermédiaire du fond de panier (220). Une structure thermoconductrice (230) est en contact avec la surface inférieure (224) de chacun des fonds de panier (220) et s'étend jusqu'à au moins la surface inférieure (214) du substrat (212).
Latest bibliographic data on file with the International Bureau