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1. WO2020203910 - METHOD FOR PROCESSING ELECTRONIC/ELECTRICAL DEVICE COMPONENT SCRAPS

Publication Number WO/2020/203910
Publication Date 08.10.2020
International Application No. PCT/JP2020/014358
International Filing Date 27.03.2020
IPC
B07B 4/02 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
07SEPARATING SOLIDS FROM SOLIDS; SORTING
BSEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, OR SIFTING OR BY USING GAS CURRENTS; OTHER SEPARATING BY DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
4Separating solids from solids by subjecting their mixture to gas currents
02while the mixtures fall
B07B 9/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
07SEPARATING SOLIDS FROM SOLIDS; SORTING
BSEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, OR SIFTING OR BY USING GAS CURRENTS; OTHER SEPARATING BY DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
9Combinations of apparatus for screening or sifting or for separating solids from solids using gas currents; General arrangement of plant, e.g. flow sheets
B09B 5/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
09DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
BDISPOSAL OF SOLID WASTE
5Operations not covered by a single other subclass or by a single other group in this subclass
B03C 1/005 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
03SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
CMAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
1Magnetic separation
005Pretreatment specially adapted for magnetic separation
Applicants
  • JX金属株式会社 JX NIPPON MINING & METALS CORPORATION [JP]/[JP]
Inventors
  • 青木 勝志 AOKI,Katsushi
  • 笹岡 英俊 SASAOKA,Hidetoshi
Agents
  • アクシス国際特許業務法人 AXIS PATENT INTERNATIONAL
Priority Data
2019-06938029.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD FOR PROCESSING ELECTRONIC/ELECTRICAL DEVICE COMPONENT SCRAPS
(FR) PROCÉDÉ DE TRAITEMENT DE DÉCHETS DE COMPOSANT DE DISPOSITIF ÉLECTRONIQUE/ÉLECTRIQUE
(JA) 電子・電気機器部品屑の処理方法
Abstract
(EN)
Provided is a method for processing electronic/electrical device component scraps, the method enabling an improvement in the efficiency of sorting, from electronic/electrical device component scraps, a raw material to be fed in a smelting step and enables reduction of losses of valuable metals. The method for processing electronic/electrical device component scraps is characterized by sorting electronic/electrical device component scraps using the force of air and magnetically sorting sorted materials resulting from removing plate-shaped materials that include valuables and that are included in electronic/electrical device component scraps.
(FR)
L'invention concerne un procédé de traitement de déchets de composant de dispositif électronique/électrique, le procédé permettant une amélioration de l'efficacité de tri, à partir de déchets de composant de dispositif électronique/électrique, une matière première devant être introduite dans une étape de fusion et permettant la réduction des pertes de métaux de valeur. Le procédé de traitement de déchets de composant de dispositif électronique/électrique est caractérisé par le tri de déchets de composant de dispositif électronique/électrique à l'aide de la force d'air et le tri magnétique de matériaux triés résultant de l'élimination de matériaux en forme de plaque qui comprennent des objets de valeur et qui sont inclus dans des déchets de composant de dispositif électronique/électrique.
(JA)
電子・電気機器部品屑から製錬工程に投入される原料の選別効率を向上でき、有価金属のロスを低減することが可能な電子・電気機器部品屑の処理方法を提供する。電子・電気機器部品屑を風力選別し、電子・電気機器部品屑に含まれる有価物を含む板状物を除去した後の選別物を磁力選別することを特徴とする電子・電気機器部品屑の処理方法である。
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