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1. WO2020203540 - CURABLE EPOXY RESIN COMPOSITION

Publication Number WO/2020/203540
Publication Date 08.10.2020
International Application No. PCT/JP2020/013293
International Filing Date 25.03.2020
IPC
C08G 59/42 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40characterised by the curing agents used
42Polycarboxylic acids; Anhydrides, halides, or low-molecular-weight esters thereof
C08G 59/66 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40characterised by the curing agents used
66Mercaptans
C09J 11/06 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
06organic
H01L 23/29 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
H01L 23/31 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
C09D 163/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
163Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
Applicants
  • 株式会社ダイセル DAICEL CORPORATION [JP]/[JP]
Inventors
  • 鈴木弘世 SUZUKI, Hirose
Agents
  • 特許業務法人後藤特許事務所 GOTO & CO.
Priority Data
2019-06807729.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CURABLE EPOXY RESIN COMPOSITION
(FR) COMPOSITION DE RÉSINE ÉPOXY DURCISSABLE
(JA) 硬化性エポキシ樹脂組成物
Abstract
(EN)
Provided is a curable epoxy resin composition which can be molded into cured articles having high heat-resistance, water-resistance and flexibility. The curable epoxy resin composition comprises an alicyclic epoxy compound (A), a curing agent (B) and a curing accelerator (C), and is characterized in that the curing agent (B) is an acid anhydride having one or two or more (2-6) -S-Rx groups in the molecule.
(FR)
L'invention concerne une composition de résine époxy durcissable qui peut être moulée en articles durcis ayant une résistance à la chaleur élevée, une résistance à l'eau et une flexibilité élevées. La composition de résine époxy durcissable comprend un composé époxy alicyclique (A), un agent de durcissement (B) et un accélérateur de durcissement (C), et est caractérisé en ce que l'agent de durcissement (B) est un anhydride d'acide ayant un ou deux groupes (2-6)-S-Rx dans la molécule.
(JA)
高い耐熱性、耐水性、及び柔軟性を備える硬化物を形成可能な硬化性エポキシ樹脂組成物を提供する。脂環式エポキシ化合物(A)と、硬化剤(B)と、硬化促進剤(C)を含む硬化性エポキシ樹脂組成物であって、硬化剤(B)が分子中に1又は2以上(2~6)の-S-Rx基を有する酸無水物であることを特徴とする硬化性エポキシ樹脂組成物。
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