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1. WO2020203264 - POLYIMIDE RESIN, POLYIMIDE VARNISH, AND POLYIMIDE FILM

Publication Number WO/2020/203264
Publication Date 08.10.2020
International Application No. PCT/JP2020/011765
International Filing Date 17.03.2020
IPC
C08G 73/10 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Applicants
  • 三菱瓦斯化学株式会社 MITSUBISHI GAS CHEMICAL COMPANY, INC. [JP]/[JP]
Inventors
  • 星野 舜 HOSHINO, Shun
  • 村山 智寿 MURAYAMA, Tomohisa
  • 安孫子 洋平 ABIKO, Yohei
  • 岡 弘明 OKA, Hiroaki
  • 三田寺 淳 MITADERA, Jun
Agents
  • 特許業務法人大谷特許事務所 OHTANI PATENT OFFICE
Priority Data
2019-06735429.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) POLYIMIDE RESIN, POLYIMIDE VARNISH, AND POLYIMIDE FILM
(FR) RÉSINE POLYIMIDE, VERNIS POLYIMIDE ET FILM POLYIMIDE
(JA) ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム
Abstract
(EN)
Provided are: a polyimide resin capable of forming films excellent in terms of colorless transparency, optical isotropy, chemical resistance (e.g., acid resistance and alkali resistance), and toughness; and a polyimide varnish and a polyimide film each containing or comprising the polyimide resin. The polyimide resin comprises constituent units A derived from tetracarboxylic dianhydrides and constituent units B derived from diamines, wherein the constituent units A comprise a constituent unit (A-1) derived from the compound represented by formula (a-1) and a constituent unit (A-2) derived from the compound represented by formula (a-2) and the constituent units B comprise a constituent unit (B-1) derived from the compound represented by formula (b-1) and a constituent unit (B-2) derived from the compound represented by formula (b-2). The polyimide varnish and the polyimide film contain or comprise the polyimide resin.
(FR)
L'invention concerne : une résine polyimide apte à former des films excellents en matière de transparence incolore, d'isotropie optique, de résistance chimique (par exemple, de résistance aux acides et de résistance aux alcalis), et de ténacité ; et un vernis polyimide et un film polyimide contenant chacun la résine polyimide. La résine polyimide comprend des motifs constitutifs A dérivées de dianhydrides tétracarboxyliques et des motifs constitutifs B dérivés de diamines, les motifs constitutifs A comprenant un motif constitutif (A-1) dérivé du composé représenté par la formule (a-1) et un motif constitutif (A-2) dérivé du composé représenté par la formule (a-2) et les motifs constitutifs B comprenant un motif constitutif (B-1) dérivé du composé représenté par la formule (b-1) et un motif constitutif (B-2) dérivé du composé représenté par la formule (b-2). Le vernis polyimide et le film polyimide contiennent la résine polyimide.
(JA)
無色透明性、光学的等方性、耐薬品性(例えば耐酸性及び耐アルカリ性)、及び靱性に優れるフィルムの形成が可能なポリイミド樹脂、並びに該ポリイミド樹脂を含むポリイミドワニス及びポリイミドフィルムを提供する。テトラカルボン酸二無水物に由来する構成単位A及びジアミンに由来する構成単位Bを有するポリイミド樹脂であって、構成単位Aが下記式(a-1)で表される化合物に由来する構成単位(A-1)と、下記式(a-2)で表される化合物に由来する構成単位(A-2)とを含み、構成単位Bが下記式(b-1)で表される化合物に由来する構成単位(B-1)と、下記式(b-2)で表される化合物に由来する構成単位(B-2)とを含む、ポリイミド樹脂、並びに該ポリイミド樹脂を含むポリイミドワニス及びポリイミドフィルム。
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