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1. WO2020203140 - ABRASIVE SUPPLY DEVICE, POLISHING DEVICE, AND ABRASIVE SUPPLY METHOD

Publication Number WO/2020/203140
Publication Date 08.10.2020
International Application No. PCT/JP2020/010798
International Filing Date 12.03.2020
IPC
B24B 57/02 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
57Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
02for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
B24B 37/00 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
B24B 37/08 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
04designed for working plane surfaces
07characterised by the movement of the work or lapping tool
08for double side lapping
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP]
Inventors
  • 福山 翔 FUKUYAMA, Sho
  • 桜井 佑輔 SAKURAI, Yusuke
Agents
  • 稲葉 良幸 INABA, Yoshiyuki
  • 大貫 敏史 ONUKI, Toshifumi
Priority Data
2019-06983901.04.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ABRASIVE SUPPLY DEVICE, POLISHING DEVICE, AND ABRASIVE SUPPLY METHOD
(FR) DISPOSITIF D'ALIMENTATION EN ABRASIF, DISPOSITIF DE POLISSAGE, ET PROCÉDÉ D'ALIMENTATION EN ABRASIF
(JA) 研磨剤供給装置、研磨装置及び研磨剤供給方法
Abstract
(EN)
An abrasive supply device is provided with: a slurry supply passage 40 having a plurality of slurry drop holes 400; an upper surface plate 10 having a plurality of slurry supply holes 100; and a slurry guide unit 50 having a plurality of slurry supply tubes 500 for guiding a slurry abrasive dropped from the slurry drop holes 400 to the corresponding slurry supply holes 100, the plurality of slurry supply tubes 500 having a slurry supply tube 501 connecting a slurry drop hole 401 and a slurry supply hole 103, and a slurry supply tube 502 connecting a slurry drop hole 402 and a slurry supply hole 102. The amounts of slurry dropping from the slurry drop hole 401 and from the slurry drop hole 402 each time have a first amount and a second amount, respectively. The slurry guide unit 50 guides the slurry abrasive such that the flowing time of the slurry abrasive passing through each of the slurry supply tube 501 and the slurry supply tube 502 is different.
(FR)
L'invention concerne un dispositif d'alimentation en abrasif comportant: un passage 40 d'alimentation en bouillie doté d'une pluralité de trous 400 de lâcher de bouillie; une plaque 10 de surface supérieure dotée d'une pluralité de trous 100 d'alimentation en bouillie; et une unité 50 de guidage de bouillie dotée d'une pluralité de tubes 500 d'alimentation en bouillie servant à guider un abrasif en bouillie lâché à partir des trous 400 de lâcher de bouillie jusqu'aux trous 100 d'alimentation en bouillie correspondants, la pluralité de tubes 500 d'alimentation en bouillie étant dotée d'un tube 501 d'alimentation en bouillie reliant un trou 401 de lâcher de bouillie et un trou 103 d'alimentation en bouillie, et d'un tube 502 d'alimentation en bouillie reliant un trou 402 de lâcher de bouillie et un trou 102 d'alimentation en bouillie. Les quantités de bouillie tombant du trou 401 de lâcher de bouillie et du trou 402 de lâcher de bouillie à chaque fois comprennent une première quantité et une seconde quantité, respectivement. L'unité 50 de guidage de bouillie guide l'abrasif en bouillie de telle façon que le temps d'écoulement de l'abrasif en bouillie passant à travers chaque tube parmi le tube 501 d'alimentation en bouillie et le tube 502 d'alimentation en bouillie soit différent.
(JA)
複数のスラリ落下孔400を有するスラリ供給通路40と、複数のスラリ供給孔100を有する上定盤10と、スラリ落下孔400から落下したスラリ状研磨剤を対応するスラリ供給孔100に案内する複数のスラリ供給管500を有するスラリ案内部50とを備え、複数のスラリ供給管500は、スラリ落下孔401及びスラリ供給孔103を連結するスラリ供給管501と、スラリ落下孔402及びスラリ供給孔102を連結するスラリ供給管502とを有し、スラリ落下孔401及びスラリ落下孔402のそれぞれの毎回落下するスラリ量は第1量及び第2量を有し、スラリ案内部50は、スラリ状研磨剤がスラリ供給管501及びスラリ供給管502のそれぞれを通過する流動時間を異なるように案内する。
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