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1. WO2020202800 - HEAT-CONDUCTING SILICONE COMPOSITION, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR DEVICE

Publication Number WO/2020/202800
Publication Date 08.10.2020
International Application No. PCT/JP2020/005048
International Filing Date 10.02.2020
IPC
H01L 23/36 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H01L 23/373 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373Cooling facilitated by selection of materials for the device
C08L 83/06 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
06containing silicon bound to oxygen-containing groups
C08K 3/28 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
28Nitrogen-containing compounds
Applicants
  • 信越化学工業株式会社 SHIN-ETSU CHEMICAL CO., LTD. [JP]/[JP]
Inventors
  • 戸谷 亘 TOYA Wataru
  • 北沢 啓太 KITAZAWA Keita
  • 山口 貴大 YAMAGUCHI Takahiro
Agents
  • 好宮 幹夫 YOSHIMIYA Mikio
  • 小林 俊弘 KOBAYASHI Toshihiro
Priority Data
2019-06987101.04.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) HEAT-CONDUCTING SILICONE COMPOSITION, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR DEVICE
(FR) COMPOSITION DE SILICONE THERMOCONDUCTRICE, SON PROCÉDÉ DE FABRICATION ET DISPOSITIF À SEMI-CONDUCTEURS
(JA) 熱伝導性シリコーン組成物、その製造方法及び半導体装置
Abstract
(EN)
The present invention is a heat-conducting silicone composition including: (A) a hydrolyzable organopolysiloxane having an alkoxysilyl group; and (B) 50-70% by volume of aluminum nitride particles, the average particle diameter thereof being 0.5-2.0 µm, and the coarse-powder content of particles having a diameter of 10 µm or greater among the particles, using a laser diffraction particle size distribution measurement method, being 1.0 vol. % of the total, the heat conductivity of the composition using a hot-disc method being 1.3W/mK or greater. The present invention provides a heat-conducting silicone composition that has high heat conductivity and can be compressed to 10 µm or less, and a method for manufacturing the same.
(FR)
La présente invention concerne une composition de silicone thermoconductrice comprenant : (A) une silicone hydrolysable ayant un groupe alkoxysilyl ; et (B) 50 à 70 % en volume de particules de nitrure d'aluminium, le diamètre moyen de particule de celles-ci étant de 0,5 à 2,0 µm, et la teneur en poudre grossière de particules ayant un diamètre de 10 µm ou plus parmi les particules, en utilisant un procédé de mesure de distribution de taille de particule par diffraction laser, représentant 1,0 % en volume du total, la conductivité thermique de la composition, en utilisant une méthode du disque chaud, étant de 1,3 W/mK ou plus. La présente invention concerne une composition de silicone thermoconductrice qui a une conductivité thermique élevée et qui peut être comprimée à 10 µm ou moins, et son procédé de fabrication.
(JA)
本発明は、(A)アルコキシシリル基を有する加水分解性オルガノポリシロキサン、(B)平均粒子径が0.5μm以上2.0μm以下であり、かつレーザー回折型粒度分布測定法による粒子中の粒子径10μm以上の粗粉の含有量が全体の1.0体積%以下である窒化アルミニウム粒子:50~70体積%を含み、ホットディスク法での熱伝導率が1.3W/mK以上のものである熱伝導性シリコーン組成物である。本発明により、高い熱伝導率を有し、10μm以下に圧縮可能である熱伝導性シリコーン組成物及びその製造方法が提供される。
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