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1. WO2020200605 - SPUTTERING TARGET FOR PRODUCING LAYERS CONTAINING MOLYBDENUM OXIDE

Publication Number WO/2020/200605
Publication Date 08.10.2020
International Application No. PCT/EP2020/055481
International Filing Date 03.03.2020
IPC
C23C 14/08 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
06characterised by the coating material
08Oxides
C23C 14/34 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
34Sputtering
H01J 37/34 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes
34operating with cathodic sputtering
CPC
C23C 14/083
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
06characterised by the coating material
08Oxides
083of refractory metals or yttrium
C23C 14/3414
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
34Sputtering
3407Cathode assembly for sputtering apparatus, e.g. Target
3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
H01J 37/3429
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
34operating with cathodic sputtering
3411Constructional aspects of the reactor
3414Targets
3426Material
3429Plural materials
Applicants
  • PLANSEE SE [AT]/[AT]
Inventors
  • O`SULLIVAN, Michael
  • WINKLER, Jörg
  • FRANZKE, Enrico
  • LINKE, Christian
  • SCHERER, Thomas
Agents
  • CIESLA, Bettina
Priority Data
19166312.929.03.2019EP
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) SPUTTERINGTARGET ZUR HERSTELLUNG MOLYBDÄNOXIDHALTIGER SCHICHTEN
(EN) SPUTTERING TARGET FOR PRODUCING LAYERS CONTAINING MOLYBDENUM OXIDE
(FR) CIBLE DE PULVÉRISATION POUR LA FABRICATION DE COUCHES CONTENANT DE L’OXYDE DE MOLYBDÈNE
Abstract
(DE)
Die vorliegende Erfindung betrifft ein Sputteringtarget mit einem elektrisch leitfähigen, oxidischen Targetmaterial, wobei das Targetmaterial mindestens ein Metalloxid von Molybdän (Mo) als metallischem Hauptbestandteil und von mindestens einem Dotierungselement M aus der Gruppe Tantal (Ta), Niob (Nb), Vanadium (V) und Titan (Ti) enthält. Bezogen auf ein Schliffbild desselben weist das Targetmaterial eine Matrixphase aus einem Mischoxid (Mo1-xMx)5O14 mit 0,01 ≤ x ≤ 0,13 auf, wobei M in diesem Mischoxid eines oder mehrere Elemente der Gruppe Tantal (Ta), Niob (Nb), Vanadium (V) und Titan (Ti) ist. Das Sputteringtarget dient zur Herstellung molybdänoxidhaltiger Schichten.
(EN)
The present invention relates to a sputtering target with an electrically conductive, oxidic target material, the target material containing at least one metal oxide of molybdenum (Mo) as the main metal component and at least one doping element M from the group consisting of tantalum (Ta), niobium (Nb), vanadium (V) and titanium (Ti). Based on a micrograph of same, the target material has a matrix phase of a mixed oxide (Mo1-xMx)5O14 where 0.01 ≤ x ≤ 0.13, M in this mixed oxide being one ore more elements of the group consisting of tantalum (Ta), niobium (Nb), vanadium (V) and titanium (Ti). The sputtering target is used to produce layers containing molybdenum oxide.
(FR)
La présente invention concerne une cible de pulvérisation comprenant un matériau de cible oxydique électriquement conducteur, le matériau de cible contenant au moins un oxyde de métal de molybdène (Mo) comme composant métallique principal et au moins un élément dopant M du groupe composé de tantale (Ta), niobium (Nb), vanadium (V) et titane (Ti). Le matériau de cible présente, sur base d'une micrographie de celui-ci, une phase matricielle composée d’un oxyde mixte (Mo1-xMx)5O14 avec 0,01 ≤ x ≤ 0,13, M représentant dans cet oxyde mixte un ou plusieurs éléments du groupe composé de tantale (Ta), niobium (Nb), vanadium (V) et titane (Ti). La cible de pulvérisation sert à la fabrication de couches contenant de l’oxyde de molybdène.
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