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1. WO2020198840 - NOVEL INHIBITED HYDROFLUORIC ACID COMPOSITION

Publication Number WO/2020/198840
Publication Date 08.10.2020
International Application No. PCT/CA2020/000046
International Filing Date 03.04.2020
IPC
C09K 3/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3Materials not provided for elsewhere
C02F 1/66 2006.01
CCHEMISTRY; METALLURGY
02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
1Treatment of water, waste water, or sewage
66by neutralisation; pH adjustment
C02F 5/08 2006.01
CCHEMISTRY; METALLURGY
02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
5Softening water; Preventing scale; Adding scale preventatives or scale removers to water, e.g. adding sequestering agents
08Treatment of water with complexing chemicals or other solubilising agents for softening, scale prevention or scale removal, e.g. adding sequestering agents
C03C 15/00 2006.01
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
CCHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
15Surface treatment of glass, not in the form of fibres or filaments, by etching
C09K 8/52 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
8Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
52Compositions for preventing, limiting or eliminating depositions, e.g. for cleaning
C09K 8/74 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
8Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
60Compositions for stimulating production by acting on the underground formation
62Compositions for forming crevices or fractures
72Eroding chemicals, e.g. acids
74combined with additives added for specific purposes
CPC
C03C 15/00
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
CCHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
15Surface treatment of glass, not in the form of fibres or filaments, by etching
C09K 13/08
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
13Etching, surface-brightening or pickling compositions
04containing an inorganic acid
08containing a fluorine compound
C09K 8/528
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
8Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
52Compositions for preventing, limiting or eliminating depositions, e.g. for cleaning
528inorganic depositions, e.g. sulfates or carbonates
C09K 8/72
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
8Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
60Compositions for stimulating production by acting on the underground formation
62Compositions for forming crevices or fractures
72Eroding chemicals, e.g. acids
C23F 1/16
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
1Etching metallic material by chemical means
10Etching compositions
14Aqueous compositions
16Acidic compositions
Applicants
  • FLUID ENERGY GROUP LTD [CA]/[CA]
Inventors
  • PURDY, Clay
  • WEISSENBERGER, Markus
  • DAWSON, Karl W.
  • WYNNYK, Kyle G.
Agents
  • Pigeon, Charles O.
Priority Data
303928805.04.2019CA
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) NOVEL INHIBITED HYDROFLUORIC ACID COMPOSITION
(FR) NOUVELLE COMPOSITION D'ACIDE FLUORHYDRIQUE INHIBÉE
Abstract
(EN)
An inhibited hydrofluoric acid aqueous composition, said composition comprising: hydrofluoric acid in solution; and a weak base selected from the group consisting of: lysine, arginine, histidine, glutamine, asparagine, tryptophan, and tyrosine; wherein said weak base and hydrofluoric acid are present in a molar ratio of at least 1:1. Also disclosed is a mud acid using this inhibited acid composition.
(FR)
L'invention concerne une composition aqueuse d'acide fluorhydrique inhibée, ladite composition comprenant : de l'acide fluorhydrique en solution ; et une base faible choisie dans le groupe constitué par : la lysine, l'arginine, l'histidine, la glutamine, l'asparagine, le tryptophane et la tyrosine ; ladite base faible et l'acide fluorhydrique étant présents dans un rapport molaire d'au moins 1 : 1. L'invention concerne également un acide à boue utilisant cette composition d'acide inhibée.
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