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1. WO2020198405 - DIE SCREENING USING INLINE DEFECT INFORMATION

Publication Number WO/2020/198405
Publication Date 01.10.2020
International Application No. PCT/US2020/024804
International Filing Date 26.03.2020
IPC
H01L 21/67 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/66 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66Testing or measuring during manufacture or treatment
G01N 23/2251 2018.01
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
23Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/-G01N17/178
22by measuring secondary emission from the material
225using electron or ion microprobes
2251using incident electron beams, e.g. scanning electron microscopy
CPC
G01N 21/9501
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws or contamination
95characterised by the material or shape of the object to be examined
9501Semiconductor wafers
G06T 2207/20081
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
2207Indexing scheme for image analysis or image enhancement
20Special algorithmic details
20081Training; Learning
G06T 2207/30148
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
2207Indexing scheme for image analysis or image enhancement
30Subject of image; Context of image processing
30108Industrial image inspection
30148Semiconductor; IC; Wafer
G06T 7/0008
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
7Image analysis
0002Inspection of images, e.g. flaw detection
0004Industrial image inspection
0008checking presence/absence
H01L 21/67282
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67242Apparatus for monitoring, sorting or marking
67282Marking devices
H01L 21/67288
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67242Apparatus for monitoring, sorting or marking
67288Monitoring of warpage, curvature, damage, defects or the like
Applicants
  • KLA CORPORATION [US]/[US]
Inventors
  • LIM, Alex (Teng Song)
  • MEENAKSHISUNDARAM, Ganesh
Agents
  • MCANDREWS, Kevin
  • MORRIS, Elizabeth M.N.
Priority Data
16/439,46512.06.2019US
62/824,90027.03.2019US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) DIE SCREENING USING INLINE DEFECT INFORMATION
(FR) FILTRAGE DE PUCE À L'AIDE D'INFORMATIONS DE DÉFAUT EN LIGNE
Abstract
(EN)
Embodiments herein include methods, systems, and apparatuses for die screening using inline defect information. Such embodiments may include receiving a plurality of defects, receiving wafersort electrical data for a plurality of dies, classifying each of the defects as a defect-of-interest, or nuisance, determining a defect-of-interest confidence for each of the defects-of-interest, determining a die return index for each of the dies containing at least one of the defects-of-interest, determining a die return index cutline, and generating an inking map. Each of the defects may he associated with a die in the plurality of dies. Each of the dies may be tagged as passing a wafersort electrical test or failing the wafersort electrical test. Classifying each of the defects as a defect-of-interest or nuisance may be accomplished using a defect classification model, which may include machine learning. The inking map may be electronically communicated to an inking system.
(FR)
La présente invention concerne, selon des modes de réalisation, des procédés, des systèmes et des appareils pour un filtrage de puce à l'aide d'informations de défaut en ligne. De tels modes de réalisation peuvent comprendre la réception d'une pluralité de défauts, la réception de données électriques de tri de tranche pour une pluralité de puces, la classification de chacun des défauts en tant que défaut d'intérêt, ou de nuisance, la détermination d'une confiance de défaut d'intérêt pour chacun des défauts d'intérêt, la détermination d'un indice de retour de puce pour chacune des puces qui contiennent au moins un des défauts d'intérêt, la détermination d'une ligne de découpe d'indice de retour de puce, et la génération d'une carte de marquage à l'encre. Chacun des défauts peut être associé à une puce dans la pluralité de puces. Chacune des puces peut être étiquetée comme ayant réussi à un essai électrique de tri de tranche ou ayant échoué à l'essai électrique de tri de tranche. La classification de chacun des défauts en tant que défaut d'intérêt ou de nuisance peut être accomplie à l'aide d'un modèle de classification de défauts, qui peut comprendre un apprentissage machine. La carte de marquage à l'encre peut être communiquée électroniquement à un système de marquage à l'encre.
Also published as
Latest bibliographic data on file with the International Bureau