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1. WO2020198019 - METHOD OF FORMING THROUGH HOLE IN GLASS

Publication Number WO/2020/198019
Publication Date 01.10.2020
International Application No. PCT/US2020/023887
International Filing Date 20.03.2020
IPC
B23K 26/382 2014.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
38by boring or cutting
382by boring
B23K 26/402 2014.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
40taking account of the properties of the material involved
402involving non-metallic material, e.g. isolators
B23K 26/70 2014.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
70Auxiliary operations or equipment
B23K 103/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
103Materials to be soldered, welded or cut
CPC
B23K 2103/54
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
50Inorganic material, e.g. metals, not provided for in B23K2103/02B23K2103/26
54Glass
B23K 26/382
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
38by boring or cutting
382by boring
B23K 26/402
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
40taking account of the properties of the material involved
402involving non-metallic material, e.g. isolators
B23K 26/70
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
70Auxiliary operations or equipment
Applicants
  • CORNING INCORPORATED [US]/[US]
Inventors
  • LESLIE, Patrick Scott
Agents
  • BROOKINS, Irene L.
Priority Data
62/823,23225.03.2019US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD OF FORMING THROUGH HOLE IN GLASS
(FR) PROCÉDÉ DE FORMATION DE TROU TRAVERSANT DANS DU VERRE
Abstract
(EN)
A method of forming a through hole in a glass substrate is provided. The method includes irradiating a surface of a glass substrate with a mid-infrared or far-infrared laser to form a pilot hole including a plurality of cracks extending radially outward from the pilot hole. The pilot hole is etched to expand a diameter of the pilot hole to at least encompass the plurality of cracks to form a through hole having a through hole entry diameter of about 200 micrometers to about 1.5 millimeters.
(FR)
L'invention concerne un procédé de formation d'un trou traversant dans un substrat en verre. Le procédé comprend l'irradiation d'une surface d'un substrat de verre avec un laser infrarouge moyen ou lointain pour former un trou pilote comprenant une pluralité de fissures s'étendant radialement vers l'extérieur à partir du trou pilote. Le trou pilote est gravé pour étendre un diamètre du trou pilote pour au moins englober la pluralité de fissures pour former un trou traversant ayant un diamètre d'entrée de trou traversant d'environ 200 micromètres à environ 1,5 millimètres.
Latest bibliographic data on file with the International Bureau