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1. WO2020197753 - NON-EQUILIBRIUM THERMAL CURING PROCESSES

Publication Number WO/2020/197753
Publication Date 01.10.2020
International Application No. PCT/US2020/021812
International Filing Date 10.03.2020
IPC
H01J 1/62 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
1Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
54Screens on or from which an image or pattern is formed, picked-up, converted, or stored; Luminescent coatings on vessels
62Luminescent screens; Selection of materials for luminescent coatings on vessels
H01J 63/04 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
63Cathode-ray or electron-stream lamps
02Details, e.g. electrode, gas filling, shape of vessel
04Vessels provided with luminescent coatings; Selection of materials for the coatings
H01L 21/3205 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
31to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers
3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers, on insulating layers; After-treatment of these layers
H01L 31/0216 2014.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
0216Coatings
H01L 31/18 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
Applicants
  • SINOVIA TECHNOLOGIES [US]/[US]
Inventors
  • BURKHARD, George
  • SLOTCAVAGE, Daniel
  • GAYNOR, Whitney
  • LIU, Bang-Yan
Agents
  • BERNSTEIN, David, P.
  • LOVEJOY, Brett, A.
  • MA, Kun
  • ANTCZAK, Andrew, J.
  • ESKER, Todd
Priority Data
62/823,42525.03.2019US
62/863,03818.06.2019US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) NON-EQUILIBRIUM THERMAL CURING PROCESSES
(FR) TRAITEMENTS DE DURCISSEMENT THERMIQUE DÉSÉQUILIBRÉ
Abstract
(EN)
A method of flash-curing a respective layer in an electronic device stack is provided. The method includes providing a stack of layers including a substrate and one or more electronically-active layers disposed on a surface of the substrate. The method further includes applying, over the stack of layers, a thermally-curable layer of material. The method further includes performing a non-equilibrium thermal process that includes raising a temperature of the thermally-curable layer of material above a first temperature for a length of time sufficient to cure the thermally- curable layer of material while maintaining the stack of layers below a second temperature that is less than the first temperature. The stack of layers is robust to temperatures below the second temperature.
(FR)
L'invention concerne un procédé de durcissement éclair d'une couche respective dans un dispositif électronique. Le procédé consiste à fournir un empilement de couches comprenant un substrat et une ou plusieurs couches électroniquement actives disposées sur une surface du substrat. Le procédé consiste en outre à appliquer, sur l'empilement de couches, une couche de matériau thermodurcissable. Le procédé consiste par ailleurs à exécuter un traitement thermique déséquilibré qui comprend l'élévation d'une température de la couche de matériau thermodurcissable au-dessus d'une première température pendant une durée suffisante pour durcir la couche de matériau thermodurcissable tout en maintenant l'empilement de couches en-deçà d'une seconde température qui est inférieure à la première température. L'empilement de couches est robuste à des températures inférieures à la seconde température.
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