Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020197643 - INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED VOLTAGE REGULATOR

Note: Text based on automatic Optical Character Recognition processes. Please use the PDF version for legal matters

[ EN ]

CLAIMS

What is claimed is:

1. An apparatus, comprising:

a first redistribution layer (RDL) structure (172) having a first plurality of conductor traces (165d, 165e);

a first molding layer (120) on the first RDL structure;

plural conductive pillars (205a, 205b) in the first molding layer, each of the conductive pillars including a first end and a second end;

a second RDL structure (115) on the first molding layer, the second RDL structure having a second plurality of conductor traces (165a, 165b); and

wherein some of the conductive pillars (205b, 205c) are electrically connected between some of the first plurality of conductor traces and some of the second plurality of conductor traces to provide a first inductor coil (155).

2. The apparatus of claim 1, comprising control and switching logic (239. 241) connected to the inductor to provide a voltage regulator.

3. The apparatus of claim 1, comprising a first semiconductor chip (130) mounted on the second RDL structure.

4. The apparatus of claim 3, wherein the first semiconductor chip comprises control and

switching logic (192) connected to the inductor to provide a voltage regulator.

5. The apparatus of claim 3, comprising a second molding layer (125) on the second RDL

structure at least partially encapsulating the first semiconductor chip.

6. The apparatus of claim 1, comprising a circuit board (110), the apparatus being mounted on the circuit board.

7. The apparatus of claim 1, comprising a high permeability core (230) positioned inside the first inductor coil.

8. The apparatus of claim 1, wherein other (205a, 205c) of the conductive pillars are electrically connected between other of the first plurality of conductor traces and other of the second plurality of conductor traces to provide a second inductor coil.

9. The apparatus of claim 8, wherein the second inductor coil is substantially co-axial with the first inductor coil.

10. A semiconductor chip device, comprising:

a first redistribution layer (RDL) structure (172) having a first plurality of conductor traces (165d, 165e);

a first molding layer (120) on the first RDL structure;

plural conductive pillars (205a, 205b) in the first molding layer, each of the conductive pillars including a first end and a second end;

a second RDL structure (115) on the first molding layer, the second RDL structure having a second plurality of conductor traces (165a, 165b);

wherein some of the conductive pillars (205b, 205c) are electrically connected between some of the first plurality of conductor traces and some of the second plurality of conductor traces to provide a first inductor coil; and

a first semiconductor chip (130) mounted on the second RDL structure, the first

semiconductor chip having voltage regulator switching and control logic (192) connected to the first inductor coil to provide an integrated voltage regulator.

11. The semiconductor chip device of claim 10, comprising a second semiconductor chip (135) mounted on the second RDL structure, the integrated voltage regulator being operable to supply a regulated voltage to the second semiconductor chip.

12. The semiconductor chip device of claim 10, comprising a second molding layer (125) on the second RDL structure at least partially encapsulating the first semiconductor chip.

13. The semiconductor chip device of claim 10, comprising a circuit board (110), the

semiconductor chip device being mounted on the circuit board.

14. The semiconductor chip device of claim 10, comprising a high permeability core (230)

positioned inside the first inductor coil.

15. The semiconductor chip device of claim 10, wherein other of the conductive pillars (205a, 205c) are electrically connected between other of the first plurality of conductor traces and other of the second plurality of conductor traces to provide a second inductor coil.

16. The semiconductor chip device of claim 15, wherein the second inductor coil is substantially co-axial with the first inductor coil.

17. A method of manufacturing, comprising:

fabricating a first redistribution layer (RDL) structure (172) having a first plurality of

conductor traces (165d, 165e);

fabricating a first molding layer (120) on the first RDL structure;

fabricating plural conductive pillars (205a, 205b) in the first molding layer, each of the

conductive pillars including a first end and a second end;

fabricating a second RDL structure (115) on the first molding layer, the second RDL structure having a second plurality of conductor traces (165a, 165b); and

electrically connecting some of the conductive pillars (205b, 205c) between some of the first plurality of conductor traces and some of the second plurality of conductor traces to provide a first inductor coil.

18. The method of claim 17, comprising connecting control and switching logic (192) to the inductor to provide a voltage regulator.

19. The method of claim 17, comprising mounting a first semiconductor chip (130) on the second RDL structure.

20. The method of claim 19, wherein the first semiconductor chip comprises control and

switching logic (192) connected to the inductor to provide a voltage regulator.

21. The method of claim 17, comprising mounting the first RDL structure on a circuit board

(110).

22. The method of claim 21, wherein the first semiconductor chip comprises control and

switching logic connected to the inductor to provide a voltage regulator.

23. The method of claim 19, comprising fabricating a second molding layer (125) on the second RDL structure at least partially encapsulating the first semiconductor chip.

24. The method of claim 17, comprising mounting the apparatus on a circuit board (110).

25. The method of claim 17, comprising a high permeability core (230) positioned inside the first inductor coil.

26. The method of claim 17, comprising electrically connecting other of the conductive pillars

(205a, 205c) between other of the first plurality of conductor traces and other of the second plurality of conductor traces to provide a second inductor coil.

27. The method of claim 26, wherein the second inductor coil is substantially co-axial with the first inductor coil.