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1. WO2020197548 - COVERS FOR ELECTRONIC DEVICES

Note: Text based on automatic Optical Character Recognition processes. Please use the PDF version for legal matters

[ EN ]

CLAIMS

What is ciasmed is;

1. A cover for an electronic device comprising:

a substrate;

an adhesive layer on a surface of the substrate;

a first thermally conductive layer on the adhesive layer;

a first oxide layer on the first thermally conductive layer;

an aluminum foil layer on the first oxide layer;

a second oxide iayer on the aluminum foil layer; and

a second thermally conductive layer on the second oxide layer.

2. The cover of claim 1 further comprising:

a thermoplastic polymer layer on the second thermally conductive layer.

3. The cover of claim 2, wherein the thermoplastic polymer layer has a thickness of from about 5 mm to about 15 mm and comprises polyethylene terephfhalate

4. The cover of claim 1 , wherein:

the adhesive layer comprises acrylic-based adhesives, natural rubber-based adhesives, styrene-butadiene rubber-based adhesives, styrenio block copolymer based adhesives, silicone-based adhesive, or combinations thereof, and

the adhesive iayer comprises from about 0 01 wt% to about 0,3 wt% thermally conductive particles selected from the group of nano or micro particles of graphene, carbon nanotube particles, nano or micro particles of graphite, nano or micro particles of aluminum, nano or micro particles of copper, nano or micro particles of sliver, nano or micro particles of silicon, nano or micro particles of gold, nano or micro particles of diamond, or combinations thereof, based on a total weight of the adhesive iayer.

5 The cover of claim 1 , wherein the substrate comprises plastic, carbon fiber, glass, metal, a composite, or a combination thereof

6. The cover of ciaim 1 , wherein the first thermally conductive layer and the second thermally conductive layer are the same and comprise graphite, graphene, or a combination thereof.

7 The cover of claim 1 , wherein the first thermally conductive layer and the second thermally conductive layer are different and comprise graphite, graphene, or a combination thereof

8 The cover of claim 1 , wherein the first oxide layer and the second oxide layer are the same and comprise anodized aluminum.

9 A coating set for a cover of an electronic device comprising;

a substrate;

an adhesive layer on a surface of the substrate;

a first thermally conductive layer on the adhesive layer;

a first oxide layer on the first thermaSiy conductive layer;

an aluminum foil layer on the first oxide layer;

a second oxide layer on the aluminum foil layer;

a second thermally conductive layer on the second oxide layer; and a thermoplastic polymer layer on the second thermally conductive layer, wherein the first thermally conductive layer and the second thermally conductive layer are same or different and each comprise graphite, graphene, or a combination thereof

10. An electronic device comprising the coating set of claim 9.

i l The coating set of claim 9, wherein the adhesive layer has a thickness of from about 5 mm to about 30 mm.

12. The coating set of claim 9, wherein the first thermally conductive layer and the second thermally conductive layer each have a thickness of about 5 mm to about 500 mm.

13. The coating set of claim 9, wherein the first oxide layer and the second oxide layer each have a thickness of about 3 mm to about 15 mm.

14. The coating set of claim 9, wherein the aluminum foil layer has a thickness of about 10 mm to about 100 mm.

15. A method of making an electronic device cover including a substrate, the method comprising:

applying an adhesive layer on a surface of the substrate;

applying a first thermally conductive layer on the adhesive layer;

applying a first oxide layer on the first thermally conductive layer;

applying an aluminum foil layer on the first oxide layer;

applying a second oxide layer on the aluminum foil layer;

applying a second thermally conductive layer on the second oxide layer; and

applying a thermoplastic polymer layer on the second thermally conductive layer.