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1. WO2020196826 - RESIN COMPOSITION AND RESIN SHEET

Publication Number WO/2020/196826
Publication Date 01.10.2020
International Application No. PCT/JP2020/013978
International Filing Date 27.03.2020
IPC
B32B 27/20 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
18characterised by the use of special additives
20using fillers, pigments, thixotroping agents
B32B 27/32 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
32comprising polyolefins
C08L 23/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
23Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
C08L 101/12 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
12characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
C08K 3/00 2018.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
H05B 33/04 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
02Details
04Sealing arrangements
Applicants
  • 味の素株式会社 AJINOMOTO CO., INC. [JP]/[JP]
Inventors
  • 奥野 真奈美 OKUNO, Manami
  • 久保 有希 KUBO, Yuki
Agents
  • 高島 一 TAKASHIMA, Hajime
Priority Data
2019-06302728.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) RESIN COMPOSITION AND RESIN SHEET
(FR) COMPOSITION DE RÉSINE ET FEUILLE DE RÉSINE
(JA) 樹脂組成物および樹脂シート
Abstract
(EN)
The present invention provides a resin composition which is capable of exhibiting higher moisture shielding properties, thereby being suitable for the formation of a sealing part of a light emitting element such as an organic EL element, an optical semiconductor such as a high luminance LED, a light-receiving element such as a solar cell, and the like. A resin composition which contains the components (A)-(C) described below, having a moisture content of 1,500 ppm or less. Component (A): a thermoplastic resin Component (B): a moisture-absorbing filler Component (C): a plate-like filler
(FR)
La présente invention concerne une composition de résine étant capable de présenter des propriétés de protection contre l'humidité supérieures, ce qui est approprié pour la formation d'une partie d'étanchéité d'un élément électroluminescent tel qu'un élément électroluminescent organique, un semi-conducteur optique tel qu'une DEL à luminance élevée, un élément récepteur de lumière tel qu'une cellule solaire, et similaire. L'invention concerne également une composition de résine qui contient les composants (A)-(C) décrits ci-dessous, ayant une teneur en humidité de 1 500 ppm ou moins. Composant (A) : une résine thermoplastique Composant (B) : une charge absorbant l'humidité Composant (C) : une charge de type plaque
(JA)
より高い水分遮蔽性を発揮することができ、有機EL素子等の発光素子、高輝度LED等の光半導体、太陽電池等の受光素子等の封止部を形成するのに適した樹脂組成物を提供すること。下記の(A)~(C)成分: (A)熱可塑性樹脂; (B)吸湿性フィラー;および (C)板状フィラー を含有し、含水率が1500ppm以下である、樹脂組成物。
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