Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020196802 - TRANSFER FILM FOR SILVER CONDUCTIVE MATERIAL PROTECTIVE FILM, PRODUCTION METHOD OF PATTERNED SILVER CONDUCTIVE MATERIAL, LAMINATE BODY AND TOUCH PANEL

Publication Number WO/2020/196802
Publication Date 01.10.2020
International Application No. PCT/JP2020/013859
International Filing Date 26.03.2020
IPC
B32B 27/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
C08F 265/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
265Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/181
C08F 265/02 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
265Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/181
02on to polymers of acids, salts or anhydrides
C08F 290/06 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
02on to polymers modified by introduction of unsaturated end groups
06Polymers provided for in subclass C08G52
C08F 299/06 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
299Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
02from unsaturated polycondensates
06from polyurethanes
C08F 2/44 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
2Processes of polymerisation
44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
Applicants
  • 富士フイルム株式会社 FUJIFILM CORPORATION [JP]/[JP]
Inventors
  • 平木 大介 HIRAKI, Daisuke
  • 有年 陽平 ARITOSHI, Yohei
  • 豊岡 健太郎 TOYOOKA, Kentaro
  • 植木 啓吾 UEKI, Keigo
Agents
  • 特許業務法人太陽国際特許事務所 TAIYO, NAKAJIMA & KATO
Priority Data
2019-05892426.03.2019JP
2019-14885214.08.2019JP
2019-16725413.09.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) TRANSFER FILM FOR SILVER CONDUCTIVE MATERIAL PROTECTIVE FILM, PRODUCTION METHOD OF PATTERNED SILVER CONDUCTIVE MATERIAL, LAMINATE BODY AND TOUCH PANEL
(FR) FILM DE TRANSFERT POUR FILM PROTECTEUR DE MATÉRIAU CONDUCTEUR D'ARGENT, PROCÉDÉ DE PRODUCTION DE MATÉRIAU CONDUCTEUR D'ARGENT À MOTIF, CORPS STRATIFIÉ ET PANNEAU TACTILE
(JA) 銀導電性材料保護膜用転写フィルム、パターン付き銀導電性材料の製造方法、積層体、及び、タッチパネル
Abstract
(EN)
This transfer film for a silver conductive material protective film comprises a temporary support body, and a photosensitive layer which is disposed on the support body and which contains a photopolymerization initiator and at least one item selected from the group consisting of binder polymers and polymerizable compounds, wherein the amount of free chloride ions contained in the photosensitive layer is less than or equal to 20ppm, the content mass average value of the ClogP values in all the binder polymers and polymerizable compounds contained in the photosensitive layer is greater than or equal to 2.75. A production method of patterned silver conductive material is provided which uses the aforementioned transfer film for a silver conductive material protective film, a laminate body is provided which has a substrate, a silver conductive material and a cured resin layer in that order and in which the free chloride ion amount contained in the cured resin layer is less than or equal to 20ppm and the ClogP value of the cured resin component contained in the cured resin layer is greater than or equal to 2.75; a touch panel is also provided.
(FR)
L'invention concerne un film de transfert pour un film protecteur de matériau conducteur d'argent, ledit film de transfert comprenant un corps de support temporaire et une couche photosensible qui est disposée sur le corps de support et qui contient un initiateur de photopolymérisation et au moins un élément choisi dans le groupe constitué de polymères de liant et de composés polymérisables, la quantité d'ions chlorure libres contenue dans la couche photosensible étant inférieure ou égale à 20 ppm, la valeur moyenne de masse de contenu des valeurs de ClogP dans tous les polymères de liant et les composés polymérisables contenus dans la couche photosensible étant supérieure ou égale à 2,75. L'invention concerne également un procédé de production de matériau conducteur d'argent à motifs qui utilise le film de transfert susmentionné pour un film protecteur de matériau conducteur d'argent ; un corps stratifié qui a un substrat, un matériau conducteur d'argent et une couche de résine durcie dans cet ordre et dans lequel la quantité d'ions chlorure libres contenue dans la couche de résine durcie est inférieure ou égale à 20 ppm et la valeur de ClogP du composant de résine durci contenu dans la couche de résine durcie est supérieure ou égale à 2,75 ; et un panneau tactile.
(JA)
銀導電性材料保護膜用転写フィルムは、仮支持体と、上記仮支持体上に、バインダーポリマー及び重合性化合物よりなる群から選ばれた少なくとも1種、並びに、光重合開始剤を含む感光性層とを有し、上記感光性層に含まれる遊離塩化物イオン量が20ppm以下であり、上記感光性層に含まれる全てのバインダーポリマー及び重合性化合物におけるClogP値の含有質量平均値が2.75以上である。上記銀導電性材料保護膜用転写フィルムを用いたパターン付き銀導電性材料の製造方法、並びに、基板と、銀導電性材料と、硬化樹脂層とをこの順に有し、上記硬化樹脂層に含まれる遊離塩化物イオン量が20ppm以下であり、上記硬化樹脂層に含まれる硬化樹脂成分のClogP値が2.75以上である積層体及びタッチパネルも提供される。
Latest bibliographic data on file with the International Bureau