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1. WO2020196795 - AFFIXING DEVICE

Publication Number WO/2020/196795
Publication Date 01.10.2020
International Application No. PCT/JP2020/013847
International Filing Date 26.03.2020
IPC
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/683 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
C09J 7/29 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
20characterised by their carriers
29Laminated material
C09J 7/38 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
30characterised by the adhesive composition
38Pressure-sensitive adhesives
Applicants
  • 三井化学東セロ株式会社 MITSUI CHEMICALS TOHCELLO, INC. [JP]/[JP]
Inventors
  • 野上 昌男 NOGAMI Masao
  • 森本 哲光 MORIMOTO Akimitsu
Agents
  • 鈴木 勝雅 SUZUKI Katsumasa
Priority Data
2019-06182827.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) AFFIXING DEVICE
(FR) DISPOSITIF DE FIXATION
(JA) 貼着装置
Abstract
(EN)
The present invention addresses the problem of providing an affixing device capable of planarizing the surface of a film 20 affixed to a major surface 10A of a plate-like body 10. An affixing device 30 for affixing a film 20 onto a plate-like body 10 is provided with: a plate-like mounting member 31 having a mounting portion 31A for mounting the plate-like body 10; a plate-like pressing member 32 installed in a position opposing the mounting member 31; and a support member 33 which is installed on an outer edge of the mounting portion 31A so as to be positioned between the mounting member 31 and the pressing member 32.
(FR)
La présente invention aborde le problème de la fourniture d'un dispositif de fixation capable de planariser la surface d'un film 20 fixé à une surface principale 10A d'un corps de type plaque 10. Un dispositif de fixation 30 pour fixer un film 20 sur un corps en forme de plaque 10 comporte : un élément de montage en forme de plaque 31 ayant une partie de montage 31A pour monter le corps en forme de plaque 10 ; un élément de pression de type plaque 32 installé dans une position opposée à l'élément de montage 31 ; et un élément de support 33 qui est installé sur un bord externe de la partie de montage 31A de façon à être positionné entre l'élément de montage 31 et l'élément de pression 32.
(JA)
  板状体10の主面10Aに貼着されたフィルム20表面を平坦化できる貼着装置を提供することを課題とするものであり、板状体10にフィルム20を貼着する貼着装置30は、前記板状体10を載置する載置部31Aが設けられた板状の載置部材31と、前記載置部材31の対向位置に設置された板状の押圧部材32と、前記載置部材31と前記押圧部材32との間に位置するように、前記載置部31Aの外縁に設置される支持部材33と、を備えている。
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