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1. WO2020196794 - PROTECTION FILM, METHOD FOR AFFIXING SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT

Publication Number WO/2020/196794
Publication Date 01.10.2020
International Application No. PCT/JP2020/013846
International Filing Date 26.03.2020
IPC
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/683 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
C09J 7/29 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
20characterised by their carriers
29Laminated material
C09J 7/38 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
30characterised by the adhesive composition
38Pressure-sensitive adhesives
Applicants
  • 三井化学東セロ株式会社 MITSUI CHEMICALS TOHCELLO, INC. [JP]/[JP]
Inventors
  • 野上 昌男 NOGAMI Masao
  • 森本 哲光 MORIMOTO Akimitsu
Agents
  • 鈴木 勝雅 SUZUKI Katsumasa
Priority Data
2019-06182827.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PROTECTION FILM, METHOD FOR AFFIXING SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT
(FR) FILM DE PROTECTION, SON PROCÉDÉ DE FIXATION ET PROCÉDÉ DE FABRICATION DE COMPOSANT SEMI-CONDUCTEUR
(JA) 保護フィルム及びその貼着方法並びに半導体部品の製造方法
Abstract
(EN)
Provided are a protection film affixing method, a semiconductor component manufacturing method, and a protection film used for an affixing method with which make it possible to suppress generation of troubles caused by a height difference in a main surface of a semiconductor wafer. The affixing method comprises an arranging step for arranging a protection film 20 so as to cover a main surface 10A of a semiconductor wafer 10, and an affixing step for affixing the protection film 20 by pressing the protection film 20 onto the main surface 10A. The main surface 10A includes a first region 12 in which bumps 11 are provided, and a second region 13 which includes at least a part of a periphery of the main surface 10A and in which the bumps 11 are not provided. The affixing step includes a compressing step for compressing the protection film 20 in a thickness direction thereof. The compressing step is performed using a pressing member 32 for pressing the protection film 20 onto the main surface 10A, and a support member 33 installed along an outer periphery of the second region 13.
(FR)
L'invention concerne un procédé de fixation de film de protection, un procédé de fabrication de composant semi-conducteur, et un film de protection utilisé pour un procédé de fixation avec lesquels il est possible de supprimer la génération de troubles provoqués par une différence de hauteur dans une surface principale d'une tranche semi-conductrice. Le procédé de fixation comprend une étape d'agencement pour agencer un film de protection 20 de manière à recouvrir une surface principale 10A d'une tranche semi-conductrice 10, et une étape de fixation pour fixer le film de protection 20 par pression du film de protection 20 sur la surface principale 10A. La surface principale 10A comprend une première région 12 dans laquelle des bosses 11 sont disposées, et une seconde région 13 qui comprend au moins une partie d'une périphérie de la surface principale 10A et dans laquelle les bosses 11 ne sont pas disposées. L'étape de fixation comprend une étape de compression pour comprimer le film de protection 20 dans une direction d'épaisseur de celui-ci. L'étape de compression est effectuée à l'aide d'un élément de pression 32 destiné à presser le film de protection 20 sur la surface principale, et un élément de support 33 installé le long d'une périphérie externe de la seconde région 13.
(JA)
  半導体ウエハの主面の段差に起因する不具合の発生を抑制することができる保護フィルムの貼着方法、半導体部品の製造方法、貼着方法で利用する保護フィルムを提供するものであり、貼着方法は、半導体ウエハ10の主面10Aを覆うように保護フィルム20を配する配置工程と、保護フィルム20を主面10Aに押し付けて貼着する貼着工程と、を備え、主面10Aは、バンプ11が配された第1領域12と、主面10Aの周縁の少なくとも一部を含む領域であるとともに、バンプ11が配されていない領域である第2領域13と、を有し、貼着工程は、保護フィルム20をその厚さ方向へ圧縮する圧縮工程を含み、圧縮工程は、保護フィルム20を主面10Aへ押し付けるための押圧部材32と、第2領域13の外周縁に沿って設置される支持部材33とを使用して行われる。
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