Processing

Please wait...

PATENTSCOPE will be unavailable a few hours for maintenance reason on Saturday 31.10.2020 at 7:00 AM CET
Settings

Settings

Goto Application

1. WO2020196790 - FIBER SHEET, AND LAYERED BODY, CIRCUIT BOARD AND ELECTRONIC BOARD USING SAME

Publication Number WO/2020/196790
Publication Date 01.10.2020
International Application No. PCT/JP2020/013827
International Filing Date 26.03.2020
IPC
B32B 5/24 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
5Layered products characterised by the non-homogeneity or physical structure of a layer
22characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous
24one layer being a fibrous or filamentary layer
B32B 27/12 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
12next to a fibrous or filamentary layer
B32B 27/38 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
38comprising epoxy resins
H05K 1/03 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
Applicants
  • パナソニックIPマネジメント株式会社 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. [JP]/[JP]
Inventors
  • 深尾 朋寛 FUKAO, Tomohiro
  • 澤田 知昭 SAWADA, Tomoaki
  • 阿部 孝寿 ABE, Takatoshi
  • 道上 恭佑 MICHIGAMI, Kyosuke
Agents
  • 小谷 昌崇 KOTANI, Masataka
  • 小谷 悦司 KOTANI, Etsuji
  • 宇佐美 綾 USAMI, Aya
Priority Data
2019-06165027.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) FIBER SHEET, AND LAYERED BODY, CIRCUIT BOARD AND ELECTRONIC BOARD USING SAME
(FR) FEUILLE DE FIBRES, ET CORPS STRATIFIÉ, CARTE DE CIRCUIT IMPRIMÉ ET CARTE ÉLECTRONIQUE L'UTILISANT
(JA) 繊維シート、並びに、それを用いた積層体、回路基板および電子基板
Abstract
(EN)
One aspect of the present invention relates to a fiber sheet: which is provided with a fiber layer and a resin layer containing a thermosetting resin; is stretchable by 1% or greater; and has an initial tensile modulus of 1 MPa to 1 GPa.
(FR)
Un aspect de la présente invention concerne une feuille de fibres : qui est pourvue d'une couche de fibres et d'une couche de résine contenant une résine thermodurcissable ; est étirable de 1 % ou plus ; et a un module en traction initial de 1 MPa à 1 GPa.
(JA)
本発明の一局面は、熱硬化性樹脂を含む樹脂層と、繊維層とを備え、1%以上の伸長が可能であり、初期引張弾性率が1MPa以上1GPa以下である、繊維シートに関する。
Latest bibliographic data on file with the International Bureau