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1. WO2020196758 - PRESSURE-SENSITIVE ADHESIVE SHEET, METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE SHEET, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Publication Number WO/2020/196758
Publication Date 01.10.2020
International Application No. PCT/JP2020/013674
International Filing Date 26.03.2020
IPC
B32B 27/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
C09J 5/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
5Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
C09J 11/04 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
04inorganic
C09J 201/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301to subdivide a semiconductor body into separate parts, e.g. making partitions
Applicants
  • リンテック株式会社 LINTEC CORPORATION [JP]/[JP]
Inventors
  • 阿久津 高志 AKUTSU, Takashi
Agents
  • 特許業務法人大谷特許事務所 OHTANI PATENT OFFICE
Priority Data
2019-06461428.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PRESSURE-SENSITIVE ADHESIVE SHEET, METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE SHEET, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
(FR) FEUILLE ADHÉSIVE SENSIBLE À LA PRESSION, PROCÉDÉ DE PRODUCTION DE FEUILLE ADHÉSIVE SENSIBLE À LA PRESSION, ET PROCÉDÉ DE PRODUCTION DE DISPOSITIF À SEMI-CONDUCTEUR
(JA) 粘着シート、粘着シートの製造方法及び半導体装置の製造方法
Abstract
(EN)
The present invention pertains to a pressure-sensitive adhesive sheet comprising: a substrate (Y); and a pressure-sensitive adhesive layer (X1) containing a polymer of energy ray-polymerizable components and thermally expandable particles, wherein the polymer is obtained by irradiating, with energy rays, a polymerizable composition which contains, as the energy ray-polymerizable components, a monomer (a1) having an energy ray-polymerizable functional group and a prepolymer (a2) having an energy ray-polymerizable functional group.
(FR)
La présente invention concerne une feuille adhésive sensible à la pression comprenant : un substrat (Y); et une couche adhésive sensible à la pression (X1) contenant un polymère de composants polymérisables par des particules thermiquement expansibles, le polymère étant obtenu par irradiation, avec des rayons énergétiques, d'une composition polymérisable qui contient, en tant que composants polymérisables par rayons énergétiques, un monomère (a1) ayant un groupe fonctionnel polymérisable par rayons énergétiques et un prépolymère (a2) ayant un groupe fonctionnel polymérisable par rayons énergétiques.
(JA)
基材(Y)と、エネルギー線重合性成分の重合体及び熱膨張性粒子を含有する粘着剤層(X1)と、を有する粘着シートであり、前記重合体が、前記エネルギー線重合性成分として、エネルギー線重合性官能基を有するモノマー(a1)及びエネルギー線重合性官能基を有するプレポリマー(a2)を含有する重合性組成物にエネルギー線を照射してなる重合体である、粘着シートに関する。
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