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1. WO2020196755 - ADHESIVE SHEET, PRODUCTION METHOD FOR ADHESIVE SHEET, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

Publication Number WO/2020/196755
Publication Date 01.10.2020
International Application No. PCT/JP2020/013671
International Filing Date 26.03.2020
IPC
B32B 27/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
C09J 5/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
5Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
C09J 11/06 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
06organic
C09J 201/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301to subdivide a semiconductor body into separate parts, e.g. making partitions
Applicants
  • リンテック株式会社 LINTEC CORPORATION [JP]/[JP]
Inventors
  • 阿久津 高志 AKUTSU, Takashi
Agents
  • 特許業務法人大谷特許事務所 OHTANI PATENT OFFICE
Priority Data
2019-06460628.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ADHESIVE SHEET, PRODUCTION METHOD FOR ADHESIVE SHEET, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
(FR) FEUILLE ADHÉSIVE, PROCÉDÉ DE PRODUCTION DE FEUILLE ADHÉSIVE ET PROCÉDÉ DE PRODUCTION DE DISPOSITIF À SEMI-CONDUCTEUR
(JA) 粘着シート、粘着シートの製造方法及び半導体装置の製造方法
Abstract
(EN)
Provided is an adhesive sheet that exhibits an appropriate adhesive force when temporarily adhered and has excellent releasing performance during heat peeling, even if an adhesive layer is formed using an energy ray-polymerizable component. Also provided are a production method for the adhesive sheet and a production method for a semiconductor device using the adhesive sheet. The adhesive sheet has a base material (Y) and an adhesive layer (X1) that contains thermally expandable particles and a polymer of an energy ray-polymerizable component. The shear storage modulus G’ (23) of the adhesive layer (X1) at 23°C is 1.0 × 104–5.0 × 107 Pa.
(FR)
La présente invention concerne une feuille adhésive qui présente une force adhésive appropriée lorsqu'elle est temporairement collée et qui affiche une excellente performance de libération pendant un pelage thermique, même si une couche adhésive est formée à l'aide d'un composant polymérisable par rayonnement d'énergie. L'invention concerne également un procédé de production de la feuille adhésive et un procédé de production d'un dispositif à semi-conducteur utilisant la feuille adhésive. La feuille adhésive présente un matériau de base (Y) et une couche adhésive (X1) qui contient des particules thermo-expansibles et un polymère d'un composant polymérisable par rayonnement d'énergie. Le module d'élasticité en cisaillement au stockage G' (23) de la couche adhésive (X1) à 23 °C est de 1,0 x 104 à 5,0 x 107 Pa.
(JA)
粘着剤層をエネルギー線重合性成分によって形成していても、仮固定時には適切な粘着力を示し、かつ加熱剥離時の剥離性に優れる粘着シート、該粘着シートの製造方法、及び該粘着シートを用いる半導体装置の製造方法を提供する。 粘着シートは、基材(Y)と、エネルギー線重合性成分の重合体及び熱膨張性粒子を含有する粘着剤層(X1)と、を有する粘着シートであり、粘着剤層(X1)の、23℃における剪断貯蔵弾性率G'(23)が、1.0×10~5.0×10Paである。
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