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1. WO2020196718 - RESIN COMPOSITION AND USE THEREOF

Publication Number WO/2020/196718
Publication Date 01.10.2020
International Application No. PCT/JP2020/013568
International Filing Date 26.03.2020
IPC
C08L 71/12 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
71Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
08Polyethers derived from hydroxy compounds or from their metallic derivatives
10from phenols
12Polyphenylene oxides
B32B 15/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
04comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08of synthetic resin
B32B 27/28 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
28comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
C08J 5/24 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5Manufacture of articles or shaped materials containing macromolecular substances
24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C08K 5/3492 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
16Nitrogen-containing compounds
34Heterocyclic compounds having nitrogen in the ring
3467having more than two nitrogen atoms in the ring
3477Six-membered rings
3492Triazines
H05K 1/03 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
Applicants
  • 四国化成工業株式会社 SHIKOKU CHEMICALS CORPORATION [JP]/[JP]
Inventors
  • 大塚 章仁 OTSUKA, Akihito
  • 柏原 隆志 KASHIWABARA, Takashi
  • 青木 和徳 AOKI, Kazunori
  • 熊野 岳 KUMANO, Takeshi
Agents
  • 特許業務法人三枝国際特許事務所 SAEGUSA & PARTNERS
Priority Data
2019-06311028.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) RESIN COMPOSITION AND USE THEREOF
(FR) COMPOSITION DE RÉSINE ET SON UTILISATION
(JA) 樹脂組成物及びその用途
Abstract
(EN)
The present invention provides a material that has a low dielectric loss tangent and is suitable for use as an insulating material for a printed wiring board or the like, a resin composition used to produce the material, and applications in which the material is used. The present invention pertains to a resin composition including a mono(C6-C20 alkyl)diallyl isocyanurate and a polyphenylene ether resin, a cured product of the resin composition, and an application of the cured product.
(FR)
La présente invention concerne un matériau qui a une faible tangente de perte diélectrique et est approprié pour être utilisé en tant que matériau isolant pour une carte de circuit imprimé ou similaire, une composition de résine utilisée pour produire le matériau, et des applications dans lesquelles le matériau est utilisé. La présente invention concerne une composition de résine comprenant un isocyanurate de mono(alkyle C6-C20)diallyle et une résine d'éther de polyphénylène, un produit durci de la composition de résine et une application du produit durci.
(JA)
本発明は、プリント配線板等の絶縁材料の用途に適した誘電正接の低い材料、当該材料の製造に用いられる樹脂組成物、並びに当該材料を用いた用途を提供する。モノ(C6~C20アルキル)ジアリルイソシアヌレート及びポリフェニレンエーテル樹脂を含む樹脂組成物、当該樹脂組成物の硬化物、並びに当該硬化物の用途に関する。
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