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1. WO2020196705 - CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION

Publication Number WO/2020/196705
Publication Date 01.10.2020
International Application No. PCT/JP2020/013529
International Filing Date 26.03.2020
IPC
C08L 83/06 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
06containing silicon bound to oxygen-containing groups
C08K 5/54 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
54Silicon-containing compounds
C09J 11/06 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
06organic
C09J 183/06 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
183Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
04Polysiloxanes
06containing silicon bound to oxygen-containing groups
H01L 21/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56Encapsulations, e.g. encapsulating layers, coatings
H01L 23/29 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
Applicants
  • リンテック株式会社 LINTEC CORPORATION [JP]/[JP]
Inventors
  • 三浦 迪 MIURA Susumu
  • 宮脇 学 MIYAWAKI Manabu
Agents
  • 大石 治仁 OHISHI Haruhito
Priority Data
2019-05861426.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION
(FR) COMPOSITION DURCISSABLE, PRODUIT DURCI, ET PROCÉDÉ D'UTILISATION D'UNE COMPOSITION DURCISSABLE
(JA) 硬化性組成物、硬化物、及び、硬化性組成物の使用方法
Abstract
(EN)
The present invention is: a curable composition containing a component (A) and a component (B); a cured product obtained by curing this curable composition; and a method for using the curable composition as an adhesive for an optical element fixing material or as a sealing material for an optical element fixing material. This curable composition exhibits excellent curing properties. Component (A): A curable polysilsesquioxane compound which has a repeating unit represented by formula (a-1). Formula (a-1) R1SiO3/2 (R1 is at least one type of group selected from the group consisting of an unsubstituted alkyl group having 1-10 carbon atoms, an alkyl group having 1-10 carbon atoms and having a substituent group (excluding a group having an epoxy ring), an unsubstituted aryl group having 6-12 carbon atoms and an aryl group having 6-12 carbon atoms and having a substituent group (excluding a group having an epoxy ring).) Component (B): A specific silicone oligomer having a repeating unit derived from a trifunctional silane compound.
(FR)
La présente invention concerne une composition durcissable contenant un constituant (A) et un constituant (B) ; un produit durci obtenu par durcissement de cette composition durcissable ; et un procédé d'utilisation de la composition durcissable comme adhésif pour un matériau de fixation d'éléments optiques ou en tant que matériau de scellement pour un matériau de fixation d'éléments optiques. Cette composition durcissable présente d'excellentes propriétés de durcissement. Constituant (A) : Un composé de polysilsesquioxane durcissable qui comporte un motif répétitif représenté par la formule (a-1). Formule (a-1) R1SiO3/2 (R1 est au moins un type de groupe choisi dans le groupe consistant en un groupe alkyle non substitué ayant 1 à 10 atomes de carbone, un groupe alkyle ayant 1 à 10 atomes de carbone et comportant un groupe substituant (à l'exclusion d'un groupe comportant un noyau époxy), un groupe aryle non substitué ayant 6 à 12 atomes de carbone et un groupe aryle ayant 6 à 12 atomes de carbone et comportant un groupe substituant (à l'exclusion d'un groupe comportant un noyau époxy). Constituant (B) : Un oligomère de silicone spécifique comportant un motif répétitif qui dérive d'un composé silane trifonctionnel.
(JA)
本発明は、下記(A)成分及び(B)成分を含有する硬化性組成物、この硬化性組成物が硬化してなる硬化物、並びに、前記硬化性組成物を、光素子固定材用接着剤又は光素子固定材用封止材として使用する方法である。本発明の硬化性組成物は、硬化性に優れる。 (A)成分:下記式(a-1)で示される繰り返し単位を有する硬化性ポリシルセスキオキサン化合物 RSiO3/2 (a-1) 〔Rは、無置換の炭素数1~10のアルキル基、置換基(エポキシ環を有する基を除く)を有する炭素数1~10のアルキル基、無置換の炭素数6~12のアリール基、及び、置換基(エポキシ環を有する基を除く)を有する炭素数6~12のアリール基からなる群から選ばれる少なくとも1つである。〕 (B)成分:3官能シラン化合物由来の繰り返し単位を有する特定のシリコーンオリゴマー
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