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1. WO2020196704 - CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION

Publication Number WO/2020/196704
Publication Date 01.10.2020
International Application No. PCT/JP2020/013528
International Filing Date 26.03.2020
IPC
C08L 83/04 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
C08G 77/24 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
77Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
04Polysiloxanes
22containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
24halogen-containing groups
C08K 5/54 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
54Silicon-containing compounds
C09J 11/06 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
06organic
C09J 183/04 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
183Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
04Polysiloxanes
H01L 21/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56Encapsulations, e.g. encapsulating layers, coatings
Applicants
  • リンテック株式会社 LINTEC CORPORATION [JP]/[JP]
Inventors
  • 宮脇 学 MIYAWAKI Manabu
  • 中山 秀一 NAKAYAMA Hidekazu
Agents
  • 大石 治仁 OHISHI Haruhito
Priority Data
2019-05861226.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION
(FR) COMPOSITION DURCISSABLE, PRODUIT DURCI ET PROCÉDÉ D'UTILISATION D'UNE COMPOSITION DURCISSABLE
(JA) 硬化性組成物、硬化物、及び、硬化性組成物の使用方法
Abstract
(EN)
The present invention is: a curable composition containing a component (A) and a component (B), with the content of the component (B) being 1-110 parts by mass relative to 100 parts by mass of the component (A); a cured product obtained by curing this curable composition; and a method for using the curable composition as an adhesive for an optical element fixing material or as a sealing material for an optical element fixing material. This curable composition exhibits good coatability. This cured product has a low refractive index. Component (A): A curable polysilsesquioxane compound which has a repeating unit represented by formula (a-1) and has a mass average molecular weight (Mw) of 4000-20,000. Formula (a-1): R1SiO3/2 (R1 is at least one type of group selected from the group consisting of an unsubstituted alkyl group having 1-10 carbon atoms, a substituted alkyl group having 1-10 carbon atoms, an unsubstituted aryl group having 6-12 carbon atoms and a substituted aryl group having 6-12 carbon atoms.) Component (B): A specific silicone oligomer which has a repeating unit represented by formula (b-1). Formula (b-1): CH3-SiO3/2
(FR)
La présente invention concerne : une composition durcissable contenant un constituant (A) et un constituant (B), la teneur en constituant (B) étant de 1 à 110 parties en masse pour 100 parties en masse du constituant (A) ; un produit durci obtenu par durcissement de cette composition durcissable ; et un procédé d'utilisation de la composition durcissable comme adhésif pour un matériau de fixation d'éléments optiques ou comme matériau de scellement pour un matériau de fixation d'éléments optiques. Cette composition durcissable présente une bonne aptitude à l'enduction. Ce produit durci présente un faible indice de réfraction. Constituant (A) : Un composé polysilsesquioxane durcissable qui comporte un motif répétitif représenté par la formule (a-1) et présente une masse moléculaire moyenne en masse (Mw) de 4 000 à 20 000. Formule (a-1) : R1SiO3/2 (R1 est au moins un type de groupe choisi dans le groupe consistant en un groupe alkyle non substitué ayant 1 à 10 atomes de carbone, un groupe alkyle substitué ayant 1 à 10 atomes de carbone, un groupe aryle non substitué ayant 6 à 12 atomes de carbone et un groupe aryle substitué ayant 6 à 12 atomes de carbone.) Constituant (B) : Un oligomère de silicone spécifique qui comporte un motif répétitif représenté par la formule (b-1). Formule (b-1) : CH3-SiO3/2
(JA)
本発明は、下記(A)成分、及び、(B)成分を含有する硬化性組成物であって、(B)成分の含有量が、(A)成分100質量部に対して1~110質量部である硬化性組成物、この硬化性組成物が硬化してなる硬化物、及び、前記硬化性組成物を、光素子固定材用接着剤又は光素子固定材用封止材として使用する方法である。本発明の硬化性組成物は良好な塗布性を有する。本発明の硬化物は屈折率が低い。 (A)成分:下記式(a-1)で示される繰り返し単位を有し、質量平均分子量(Mw)が4,000~20,000である硬化性ポリシルセスキオキサン化合物 RSiO3/2 (a-1) 〔Rは、無置換の炭素数1~10のアルキル基、置換基を有する炭素数1~10のアルキル基、無置換の炭素数6~12のアリール基、及び、置換基を有する炭素数6~12のアリール基からなる群から選ばれる少なくとも1つである。〕 (B)成分:下記式(b-1)で示される繰り返し単位を有する特定のシリコーンオリゴマー CH-SiO3/2 (b-1)
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