Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020196645 - POLISHING COMPOSITION

Publication Number WO/2020/196645
Publication Date 01.10.2020
International Application No. PCT/JP2020/013389
International Filing Date 25.03.2020
IPC
C09K 3/14 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3Materials not provided for elsewhere
14Anti-slip materials; Abrasives
B24B 37/00 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
Applicants
  • 株式会社フジミインコーポレーテッド FUJIMI INCORPORATED [JP]/[JP]
Inventors
  • 土屋 公亮 TSUCHIYA, Kohsuke
  • 浅田 真希 ASADA, Maki
  • 市坪 大輝 ICHITSUBO, Taiki
Agents
  • 安部 誠 ABE, Makoto
Priority Data
2019-06374128.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) POLISHING COMPOSITION
(FR) COMPOSITION DE POLISSAGE
(JA) 研磨用組成物
Abstract
(EN)
Provided is a polishing composition having excellent ability to reduce haze on a surface of a polished subject. The polishing composition according to the present invention contains abrasive grains, a basic compound, a water-soluble polymer, and water. The water-soluble polymer contains at least a water-soluble polymer P1 and a water-soluble polymer P2. Here, the water-soluble polymer P1 is an acetalized polyvinyl alcohol-based polymer, and the water-soluble polymer P2 is a water-soluble polymer other than the acetalized polyvinyl alcohol-based polymer.
(FR)
L'invention concerne une composition de polissage ayant une excellente aptitude à réduire le trouble sur une surface d'un sujet poli. La composition de polissage selon la présente invention contient des grains abrasifs, un composé basique, un polymère hydrosoluble et de l'eau. Le polymère hydrosoluble contient au moins un polymère hydrosoluble P1 et un polymère hydrosoluble P2. Le polymère hydrosoluble P1 est un polymère à base d'alcool polyvinylique acétalisé, et le polymère hydrosoluble P2 est un polymère hydrosoluble autre que le polymère à base d'alcool polyvinylique acétalisé.
(JA)
研磨対象物表面のヘイズを低減する性能に優れた研磨用組成物を提供する。本発明により提供される研磨用組成物は、砥粒と塩基性化合物と水溶性高分子と水とを含む。上記水溶性高分子は、少なくとも水溶性高分子P1と水溶性高分子P2を含む。ここで、上記水溶性高分子P1はアセタール化ポリビニルアルコール系ポリマーであり、上記水溶性高分子P2はアセタール化ポリビニルアルコール系ポリマー以外の水溶性高分子である。
Latest bibliographic data on file with the International Bureau