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1. WO2020196644 - BULK BORON NITRIDE PARTICLES, THERMALLY CONDUCTIVE RESIN COMPOSITION, AND HEAT DISSIPATING MEMBER

Publication Number WO/2020/196644
Publication Date 01.10.2020
International Application No. PCT/JP2020/013386
International Filing Date 25.03.2020
IPC
C01B 21/064 2006.01
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF
21Nitrogen; Compounds thereof
06Binary compounds of nitrogen with metals, with silicon, or with boron
064with boron
C08K 3/38 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
38Boron-containing compounds
C08K 9/06 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
9Use of pretreated ingredients
04Ingredients treated with organic substances
06with silicon-containing compounds
C08L 101/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
Applicants
  • デンカ株式会社 DENKA COMPANY LIMITED [JP]/[JP]
Inventors
  • 竹田 豪 TAKEDA, Go
  • 田中 孝明 TANAKA, Takaaki
Agents
  • 田口 昌浩 TAGUCHI, Masahiro
  • 虎山 滋郎 TORAYAMA, Jiro
  • 伊藤 高志 ITO, Takashi
  • 鈴木 康義 SUZUKI, Yasuyoshi
Priority Data
2019-06032427.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) BULK BORON NITRIDE PARTICLES, THERMALLY CONDUCTIVE RESIN COMPOSITION, AND HEAT DISSIPATING MEMBER
(FR) PARTICULES DE NITRURE DE BORE EN VRAC, COMPOSITION DE RÉSINE THERMOCONDUCTRICE ET ÉLÉMENT DE DISSIPATION DE CHALEUR
(JA) 塊状窒化ホウ素粒子、熱伝導樹脂組成物及び放熱部材
Abstract
(EN)
The present invention provides bulk boron nitride particles that comprise flocculated hexagonal boron nitride primary particles and include a spacer coupling agent. The thermally conductive resin composition of the present invention includes these bulk boron nitride particles. The heat dissipating member of the present invention uses this thermally conductive resin composition. The present invention can provide: bulk boron nitride particles capable of suppressing the occurrence of voids in a heat dissipating member produced when mixed with a resin; a thermally conductive resin composition including these bulk boron nitride particles; and a heat dissipating member using this thermally conductive resin composition.
(FR)
La présente invention concerne des particules de nitrure de bore en vrac qui comprennent des particules primaires de nitrure de bore hexagonal floculées et un agent de couplage d'espaceur. La composition de résine thermoconductrice de la présente invention comprend ces particules de nitrure de bore en vrac. L'élément de dissipation de chaleur de la présente invention utilise cette composition de résine thermoconductrice. La présente invention peut fournir : des particules de nitrure de bore en vrac capables de supprimer l'apparition de vides dans un élément de dissipation de chaleur produit lorsqu'elles sont mélangées avec une résine; une composition de résine thermoconductrice comprenant ces particules de nitrure de bore en vrac; et un élément de dissipation de chaleur utilisant cette composition de résine thermoconductrice.
(JA)
本発明は、六方晶窒化ホウ素一次粒子が凝集してなる塊状窒化ホウ素粒子であって、スペーサー型カップリング剤を含む。本発明の熱伝導樹脂組成物は本発明の塊状窒化ホウ素粒子を含む。本発明の放熱部材は本発明の熱伝導樹脂組成物を用いたものである。本発明によれば、樹脂と混合して製造した放熱部材におけるボイドの発生を抑制できる塊状窒化ホウ素粒子、その塊状窒化ホウ素粒子を含む熱伝導樹脂組成物及びその熱伝導樹脂組成物を用いた放熱部材を提供することができる。
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