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1. WO2020196643 - BORON NITRIDE AGGREGATED PARTICLES, THERMAL CONDUCTIVE RESIN COMPOSITION, AND HEAT DISSIPATION MEMBER

Publication Number WO/2020/196643
Publication Date 01.10.2020
International Application No. PCT/JP2020/013385
International Filing Date 25.03.2020
IPC
C01B 21/064 2006.01
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF
21Nitrogen; Compounds thereof
06Binary compounds of nitrogen with metals, with silicon, or with boron
064with boron
C08K 3/38 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
38Boron-containing compounds
C08K 7/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7Use of ingredients characterised by shape
C08L 101/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
Applicants
  • デンカ株式会社 DENKA COMPANY LIMITED [JP]/[JP]
Inventors
  • 竹田 豪 TAKEDA, Go
  • 田中 孝明 TANAKA, Takaaki
Agents
  • 田口 昌浩 TAGUCHI, Masahiro
  • 虎山 滋郎 TORAYAMA, Jiro
  • 伊藤 高志 ITO, Takashi
  • 鈴木 康義 SUZUKI, Yasuyoshi
Priority Data
2019-06028627.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) BORON NITRIDE AGGREGATED PARTICLES, THERMAL CONDUCTIVE RESIN COMPOSITION, AND HEAT DISSIPATION MEMBER
(FR) PARTICULES AGRÉGÉES DE NITRURE DE BORE, COMPOSITION DE RÉSINE THERMOCONDUCTRICE ET ÉLÉMENT DE DISSIPATION DE CHALEUR
(JA) 塊状窒化ホウ素粒子、熱伝導樹脂組成物及び放熱部材
Abstract
(EN)
The present invention relates to boron nitride aggregated particles which are formed by aggregating hexagonal boron nitride primary particles, have a specific surface area of 2-6 m2/g as measured by the BET method, and have a collapse strength of 5 MPa or more. A thermal conductive resin composition according to the present invention contains boron nitride aggregated particles according to the present invention. A heat dissipation member according to the present invention uses a thermal conductive resin composition according to the present invention. According to the present invention, it is possible to provide: boron nitride aggregated particles capable of suppressing the occurrence of voids in a heat dissipation member, and improving the dielectric breakdown characteristics and thermal conductivity of the heat dissipation member; a thermal conductive resin composition comprising said boron nitride aggregated particles; and a heat dissipation member using said thermal conductive resin composition.
(FR)
La présente invention concerne des particules agrégées de nitrure de bore qui sont formées par agrégation de particules primaires de nitrure de bore hexagonal, ont une surface spécifique de 2 à 6 m2/g telle que mesurée par la méthode BET, et ont une résistance à l'affaissement de 5 MPa ou plus. Une composition de résine thermoconductrice selon la présente invention contient des particules agrégées de nitrure de bore selon la présente invention. Un élément de dissipation de chaleur selon la présente invention utilise une composition de résine thermoconductrice selon la présente invention. Selon la présente invention, il est possible de fournir : des particules agrégées de nitrure de bore capables de supprimer l'apparition de vides dans un élément de dissipation de chaleur, et d'améliorer les caractéristiques de claquage diélectrique et la conductivité thermique de l'élément de dissipation de chaleur; une composition de résine thermoconductrice comprenant lesdites particules agrégées de nitrure de bore; et un élément de dissipation de chaleur utilisant ladite composition de résine thermoconductrice.
(JA)
本発明は、六方晶窒化ホウ素一次粒子が凝集してなる塊状窒化ホウ素粒子であって、BET法により測定した比表面積が2~6m/gであり、圧壊強度が5MPa以上である。本発明の熱伝導樹脂組成物は本発明の塊状窒化ホウ素粒子を含む。本発明の放熱部材は本発明の熱伝導樹脂組成物を用いたものである。本発明によれば、放熱部材のボイドの発生を抑制し、放熱部材の絶縁破壊特性及び熱伝導性を改善できる塊状窒化ホウ素粒子、その塊状窒化ホウ素粒子を含む熱伝導樹脂組成物及びその熱伝導樹脂組成物を用いた放熱部材を提供することができる。
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