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1. WO2020196528 - CIRCUIT SUBSTRATE AND HEAT DISSIPATION SUBSTRATE OR ELECTRONIC DEVICE PROVIDED WITH SAME

Publication Number WO/2020/196528
Publication Date 01.10.2020
International Application No. PCT/JP2020/013039
International Filing Date 24.03.2020
IPC
C22C 21/00 2006.01
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
21Alloys based on aluminium
H01L 23/13 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
13characterised by the shape
H01L 23/36 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H01L 23/373 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373Cooling facilitated by selection of materials for the device
C04B 37/02 2006.01
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
37Joining burned ceramic articles with other burned ceramic articles or other articles by heating
02with metallic articles
B23K 35/28 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
24Selection of soldering or welding materials proper
28with the principal constituent melting at less than 950°C
Applicants
  • 京セラ株式会社 KYOCERA CORPORATION [JP]/[JP]
Inventors
  • 阿部 裕一 ABE,Yuichi
  • 宗石 猛 MUNEISHI,Takeshi
Priority Data
2019-05684125.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CIRCUIT SUBSTRATE AND HEAT DISSIPATION SUBSTRATE OR ELECTRONIC DEVICE PROVIDED WITH SAME
(FR) SUBSTRAT DE CIRCUIT ET SUBSTRAT DE DISSIPATION DE CHALEUR OU DISPOSITIF ÉLECTRONIQUE ÉQUIPÉ DE CELUI-CI
(JA) 回路基体およびこれを備える放熱基体または電子装置
Abstract
(EN)
A circuit substrate according to the present disclosure includes: a substrate made of ceramic; a bonding layer positioned on the substrate; and a metal layer positioned on the bonding layer. In addition, the metal layer contains copper. In addition, the bonding layer contains aluminum, silicon, and oxygen.
(FR)
Un substrat de circuit selon la présente invention comprend : un substrat fait de céramique ; une couche de liaison positionnée sur le substrat ; et une couche métallique positionnée sur la couche de liaison. De plus, la couche métallique contient du cuivre. En outre, la couche de liaison contient de l'aluminium, du silicium et de l'oxygène.
(JA)
本開示の回路基体は、セラミックスからなる基体と、該基体上に位置する接合層と、該接合層上に位置する金属層と、を備える。また、金属層は、銅を含む。また、接合層は、アルミニウム、珪素および酸素を含む。
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