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1. WO2020196497 - MOLD RELEASING FILM FOR PRINTED WIRING BOARD MANUFACTURING PROCESS, PRINTED BOARD MANUFACTURING METHOD, PRINTED BOARD MANUFACTURING DEVICE, AND PRINTED BOARD

Publication Number WO/2020/196497
Publication Date 01.10.2020
International Application No. PCT/JP2020/012959
International Filing Date 24.03.2020
IPC
B32B 27/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
B32B 7/022 2019.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
02Physical, chemical or physicochemical properties
022Mechanical properties
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
Applicants
  • 三井化学東セロ株式会社 MITSUI CHEMICALS TOHCELLO, INC. [JP]/[JP]
Inventors
  • 工藤 俊介 KUDOU Syunsuke
Agents
  • 特許業務法人浅村特許事務所 ASAMURA PATENT OFFICE, P.C.
Priority Data
2019-06430928.03.2019JP
2019-06919729.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) MOLD RELEASING FILM FOR PRINTED WIRING BOARD MANUFACTURING PROCESS, PRINTED BOARD MANUFACTURING METHOD, PRINTED BOARD MANUFACTURING DEVICE, AND PRINTED BOARD
(FR) FILM DE DÉMOULAGE POUR PROCESSUS DE FABRICATION DE CARTE DE CIRCUIT IMPRIMÉ, PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT IMPRIMÉ, DISPOSITIF DE FABRICATION DE CARTE DE CIRCUIT IMPRIMÉ, ET CARTE DE CIRCUIT IMPRIMÉ
(JA) プリント配線基板製造プロセス用離型フィルム、プリント基板の製造方法、プリント基板製造装置、及びプリント基板
Abstract
(EN)
Provided are: a mold releasing film for a printed wiring board manufacturing process that has followability, crease resistance, and releasability at a high level; and a printed board manufacturing method that has releasability, prevention of outflow of adhesive, and prevention of occurrence of wrinkles in a mold releasing film at a high level. The above problem is solved by a mold releasing film for a printed wiring board manufacturing process that includes at least a mold releasing layer (A) and an intermediate layer (B), the mold releasing film characterized in that the mold releasing layer (A) has a thickness of 15 μm or less, and the intermediate layer (B) has a modulus of elasticity of tension of 11 MPa or more at 180°C, and a printed board manufacturing method using the mold releasing film for a process.
(FR)
Cette invention concerne : un film de démoulage pour un processus de fabrication de carte de circuit imprimé, qui a une conformabilité, une résistance au pliage et une aptitude au démoulage élevées ; et un procédé de fabrication d'une carte de circuit imprimé qui a une aptitude au démoulage, une prévention de l'écoulement d'adhésif et une prévention du plissage élevées dans un film de démoulage. Plus particulièrement, l'invention concerne un film de démoulage pour un processus de fabrication de carte de circuit imprimé qui comprend au moins une couche de démoulage (A) et une couche intermédiaire (B), le film de démoulage étant caractérisé en ce que la couche de démoulage (A) a une épaisseur de 15 µm ou moins, et la couche intermédiaire (B) a un module d'élasticité de traction de 11 MPa ou plus à 180 °C. L'invention concerne en outre un procédé de fabrication de carte de circuit imprimé utilisant le film de démoulage pour un processus.
(JA)
追従性、耐シワ性、及び離型性を、高いレベルで兼ね備えた、プリント配線基板製造プロセス用離型フィルム、並びに離型性、接着剤の流出防止、及び離型フィルムのシワ発生の防止を高いレベルで兼ね備えた、プリント基板の製造方法、を提供する。上記課題は、少なくとも離型層(A)と中間層(B)とを含む、プリント配線基板製造プロセス用離型フィルムであって、離型層(A)の厚みが15μm以下であり、中間層(B)の180℃における引張弾性率が11MPa以上であることを特徴とする、上記プリント配線基板製造プロセス用離型フィルム、並びにかかるプロセス用離型フィルムを用いたプリント基板の製造方法、によって解決される。
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