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1. WO2020196362 - MULTILAYER BODY, COMPOSITION, AND KIT FOR FORMING MULTILAYER BODY

Publication Number WO/2020/196362
Publication Date 01.10.2020
International Application No. PCT/JP2020/012593
International Filing Date 23.03.2020
IPC
C08F 220/30 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
220Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide, or nitrile thereof
02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
10Esters
26Esters containing oxygen in addition to the carboxy oxygen
30containing aromatic rings in the alcohol moiety
G03F 7/004 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/038 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
038Macromolecular compounds which are rendered insoluble or differentially wettable
G03F 7/039 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
039Macromolecular compounds which are photodegradable, e.g. positive electron resists
G03F 7/11 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
09characterised by structural details, e.g. supports, auxiliary layers
11having cover layers or intermediate layers, e.g. subbing layers
G03F 7/20 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
Applicants
  • 富士フイルム株式会社 FUJIFILM CORPORATION [JP]/[JP]
Inventors
  • 中村 敦 NAKAMURA Atsushi
  • 高桑 英希 TAKAKUWA Hideki
Agents
  • 特許業務法人特許事務所サイクス SIKs & Co.
Priority Data
2019-06090127.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) MULTILAYER BODY, COMPOSITION, AND KIT FOR FORMING MULTILAYER BODY
(FR) CORPS MULTICOUCHE, COMPOSITION ET KIT POUR FORMER UN CORPS MULTICOUCHE
(JA) 積層体、組成物、及び、積層体形成用キット
Abstract
(EN)
A multilayer body which sequentially comprises a base material, an organic layer, a protective layer and a photosensitive layer in this order, and which is configured such that: the photosensitive layer contains a resin that has a repeating unit having an acid-decomposable group represented by formula (A1); the content of a repeating unit having a polar group in the resin is less than 10% by mass with respect to the total mass of the resin; the photosensitive layer is subjected to a development process that uses a developer liquid; and the protective layer is subjected to a removal process that uses a remover liquid. A composition that is used for the formation of a protective layer or a photosensitive layer, which is contained in the above-described multilayer body; and a kit for forming a multilayer body, which is used for the formation of the above-described multilayer body.
(FR)
Corps multicouche qui comprend séquentiellement un matériau de base, une couche organique, une couche protectrice et une couche photosensible, dans cet ordre, et qui est configuré de telle sorte que la couche photosensible contient une résine avec une unité de répétition ayant un groupe décomposable par un acide représenté par la formule (A1) ; le contenu d'une unité de répétition ayant un groupe polaire dans la résine est inférieur à 10 % en masse par rapport à la masse totale de la résine ; la couche photosensible est soumise à un processus de développement qui utilise un liquide révélateur ; et la couche protectrice est soumise à un processus d'élimination qui utilise un liquide décapant. La présente invention comprend également une composition utilisée pour la formation d'une couche protectrice ou d'une couche photosensible qui est contenue dans le corps multicouche décrit ci-dessus ; et un kit pour former un corps multicouche qui est utilisé pour la formation du corps multicouche décrit ci-dessus.
(JA)
基材、有機層、保護層及び感光層をこの順に含み、上記感光層が、下記式(A1)で表される酸分解性基を有する繰返し単位を有する樹脂を含み、上記樹脂に含まれる極性基を有する繰返し単位の含有量が、上記樹脂の全質量に対して10質量%未満であり、上記感光層は現像液を用いた現像に供せられ、上記保護層は剥離液を用いた除去に供せられる、積層体、上記積層体に含まれる保護層又は感光層の形成に用いられる組成物、及び、上記積層体の形成に用いられる積層体形成用キット。
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