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1. WO2020196333 - COOLING STRUCTURE

Publication Number WO/2020/196333
Publication Date 01.10.2020
International Application No. PCT/JP2020/012485
International Filing Date 19.03.2020
IPC
H01L 23/36 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H01L 23/467 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
46involving the transfer of heat by flowing fluids
467by flowing gases, e.g. air
H01L 23/473 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
46involving the transfer of heat by flowing fluids
473by flowing liquids
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
Applicants
  • 昭和電工マテリアルズ株式会社 SHOWA DENKO MATERIALS CO., LTD. [JP]/[JP]
Inventors
  • 庄田 広明 SHOUDA, Hiroaki
  • 山下 孝宏 YAMASHITA, Takahiro
  • 藤澤 和武 FUJISAWA, Kazutake
Agents
  • 特許業務法人太陽国際特許事務所 TAIYO, NAKAJIMA & KATO
Priority Data
2019-05569422.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) COOLING STRUCTURE
(FR) STRUCTURE DE REFROIDISSEMENT
(JA) 冷却構造体
Abstract
(EN)
This cooling structure is provided with a resin flowpath forming member which forms a flowpath for circulating a refrigerant, a plate-shape, metal thermal diffusion unit which is embedded in the flowpath forming member or is bonded to the flowpath forming member, and one or multiple cooling fins which extend from the thermal diffusion unit into the flow path, and at least the surface of which is made of resin.
(FR)
Cette structure de refroidissement est pourvue d'un élément de formation de trajet d'écoulement de résine qui forme un trajet d'écoulement pour faire circuler un fluide frigorigène, une unité de diffusion thermique métallique en forme de plaque qui est incorporée dans l'élément de formation de trajet d'écoulement ou est liée à l'élément de formation de trajet d'écoulement, et une ou plusieurs ailettes de refroidissement qui s'étendent de l'unité de diffusion thermique dans le trajet d'écoulement, et dont au moins la surface est constituée de résine.
(JA)
冷媒を流通させる流路を形成する樹脂製の流路形成部材と、前記流路形成部材に埋設された、又は、前記流路形成部材に接合された、板状かつ金属製である熱拡散部と、前記熱拡散部から前記流路内に延設され、少なくとも表面が樹脂製の1つ又は複数の冷却フィンと、を備える冷却構造体。
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