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1. WO2020196332 - COOLING STRUCTURE

Publication Number WO/2020/196332
Publication Date 01.10.2020
International Application No. PCT/JP2020/012484
International Filing Date 19.03.2020
IPC
H01L 23/36 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H01L 23/467 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
46involving the transfer of heat by flowing fluids
467by flowing gases, e.g. air
H01L 23/473 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
46involving the transfer of heat by flowing fluids
473by flowing liquids
H01L 23/48 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
H01L 23/36
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
H01L 23/467
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
46involving the transfer of heat by flowing fluids
467by flowing gases, e.g. air
H01L 23/473
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
46involving the transfer of heat by flowing fluids
473by flowing liquids
H01L 23/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
H05K 7/20
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
Applicants
  • 昭和電工マテリアルズ株式会社 SHOWA DENKO MATERIALS CO., LTD. [JP]/[JP]
Inventors
  • 庄田 広明 SHOUDA, Hiroaki
  • 山下 孝宏 YAMASHITA, Takahiro
  • 藤澤 和武 FUJISAWA, Kazutake
Agents
  • 特許業務法人太陽国際特許事務所 TAIYO, NAKAJIMA & KATO
Priority Data
2019-05569322.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) COOLING STRUCTURE
(FR) STRUCTURE DE REFROIDISSEMENT
(JA) 冷却構造体
Abstract
(EN)
This cooling structure is provided with: a flow passage forming member that is made of resin and forms a flow passage that circulates a coolant; an inflow port that causes the coolant to flow into the flow passage; an outflow port that causes the coolant to flow out of the flow passage; and a plurality of objects to be cooled that are to be cooled by the coolant, wherein the flow passage is configured such that the coolant introduced from the inflow port directly reach at least two of the objects to be cooled.
(FR)
La présente invention concerne une structure de refroidissement comprenant : un élément de formation de passage d'écoulement qui est fait de résine et forme un passage d'écoulement qui fait circuler un fluide de refroidissement; un orifice d'entrée qui amène le fluide de refroidissement à s'écouler dans le passage d'écoulement; un orifice de sortie qui amène le fluide de refroidissement à s'écouler hors du passage d'écoulement; et une pluralité d'objets à refroidir qui doivent être refroidis par le fluide de refroidissement, le passage d'écoulement étant conçu de telle sorte que le fluide de refroidissement introduit à partir de l'orifice d'entrée atteigne directement au moins deux des objets à refroidir.
(JA)
冷却構造体は、冷媒を流通させる流路を形成する樹脂製の流路形成部材と、前記冷媒を前記流路に流入させる流入口と、前記冷媒を前記流路から流出させる流出口と、前記冷媒により冷却される複数の被冷却体と、を備え、前記流入口から流入した前記冷媒が前記被冷却体のうちの少なくとも2つの被冷却体に直接到達するように、前記流路が構成される。
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