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1. WO2020196299 - METAL PASTE, BONDING METHOD AND METHOD FOR PRODUCING BONDED BODY

Publication Number WO/2020/196299
Publication Date 01.10.2020
International Application No. PCT/JP2020/012389
International Filing Date 19.03.2020
IPC
B22F 1/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
1Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
B22F 1/02 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
1Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
02comprising coating of the powder
B22F 7/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
7Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting
06of composite workpieces or articles from parts, e.g. to form tipped tools
08with one or more parts not made from powder
Applicants
  • ハリマ化成株式会社 HARIMA CHEMICALS, INC. [JP]/[JP]
Inventors
  • 中城 治之 NAKAJO Haruyuki
  • 吉本 瑞樹 YOSHIMOTO Mizuki
Agents
  • 特許業務法人パテントボックス PATENTBOX IP LAW FIRM
Priority Data
2019-05553822.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) METAL PASTE, BONDING METHOD AND METHOD FOR PRODUCING BONDED BODY
(FR) PÂTE MÉTALLIQUE, PROCÉDÉ DE LIAISON ET PROCÉDÉ DE PRODUCTION D'UN CORPS LIÉ
(JA) 金属ペースト、接合方法及び接合体の製造方法
Abstract
(EN)
A metal paste which is used for bonding at a low temperature of 600°C or less, and which contains metal particles having an average particle diameter of 1-100 μm, metal nanoparticles having an average particle diameter of 1-500 nm, a stress relaxation material, and a dispersion where the metal particles, the metal nanoparticles and the stress relaxation material are dispersed.
(FR)
L'invention concerne une pâte métallique qui est utilisée pour une liaison à une température basse inférieure ou égale à 600°C, et qui contient des particules métalliques ayant un diamètre de particule moyen de 1 à 100 µm, des nanoparticules métalliques ayant un diamètre moyen de particule de 1 à 500 nm, un matériau de relaxation des contraintes, et une dispersion où les particules métalliques, les nanoparticules métalliques et le matériau de relaxation des contraintes sont dispersés.
(JA)
600℃以下での低温接合に用いる金属ペーストであって、平均粒子径が1~100μmである金属粒子と、平均粒子径が1~500nmである金属ナノ粒子と、応力緩和材と、前記金属粒子、前記金属ナノ粒子及び前記応力緩和材を分散させる分散媒と、を含む、金属ペースト。
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