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1. WO2020196235 - PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING RESIST PATTERN FILM, METHOD FOR MANUFACTURING PLATED FORMED OBJECT, AND METHOD FOR MANUFACTURING TIN-SILVER-PLATED FORMED OBJECT

Publication Number WO/2020/196235
Publication Date 01.10.2020
International Application No. PCT/JP2020/012235
International Filing Date 19.03.2020
IPC
C25D 5/02 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
02Electroplating of selected surface areas
G03F 7/004 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/039 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
039Macromolecular compounds which are photodegradable, e.g. positive electron resists
G03F 7/20 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
G03F 7/40 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26Processing photosensitive materials; Apparatus therefor
40Treatment after imagewise removal, e.g. baking
Applicants
  • JSR株式会社 JSR CORPORATION [JP]/[JP]
Inventors
  • 西口 直希 NISHIGUCHI Naoki
  • 松本 朋之 MATSUMOTO Tomoyuki
  • 遠藤 彩子 ENDO Ayako
Agents
  • 特許業務法人SSINPAT SSINPAT PATENT FIRM
Priority Data
2019-06028327.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING RESIST PATTERN FILM, METHOD FOR MANUFACTURING PLATED FORMED OBJECT, AND METHOD FOR MANUFACTURING TIN-SILVER-PLATED FORMED OBJECT
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, PROCÉDÉ DE FABRICATION D'UN FILM À MOTIF DE RÉSERVE, PROCÉDÉ DE FABRICATION D'UN OBJET FORMÉ PLAQUÉ ET PROCÉDÉ DE FABRICATION D'UN OBJET FORMÉ PLAQUÉ D'ÉTAIN-ARGENT
(JA) 感光性樹脂組成物、レジストパターン膜の製造方法、メッキ造形物の製造方法、および錫銀メッキ造形物の製造方法
Abstract
(EN)
The present invention provides a photosensitive resin composition containing a polymer (A) having and acid-dissociable group, a photoacid generator (B), and a solvent (C), the solvent (C) containing 80-95 mass% of propylene glycol monomethylether acetate (C1) and 5-18 mass% of 3-methoxybutyl acetate (C2), the content ratio of another solvent (C3) in the solvent (C) being 1-10 mass%, and the content ratio of the solvent (C) included in the photosensitive resin composition being less than 60 mass%.
(FR)
La présente invention fournit une composition de résine photosensible contenant un polymère (A) ayant un groupe dissociable par un acide, un générateur de photoacides (B) et un solvant (C), le solvant (C) contenant 80 à 95 % en masse d'acétate de monométhyléther de propylèneglycol (C1) et 5 à 18 % en masse d'acétate de 3-méthoxybutyle (C2), le rapport de teneur d'un autre solvant (C3) dans le solvant (C) étant de 1 à 10 % en masse et le rapport de teneur du solvant (C) inclus dans la composition de résine photosensible étant inférieur à 60 % en masse.
(JA)
酸解離性基を有する重合体(A)、光酸発生剤(B)、および溶剤(C)を含有する感光性樹脂組成物であり、前記溶剤(C)が、プロピレングリコールモノメチルエーテルアセテート(C1)を80~95質量%、3-メトキシブチルアセテート(C2)を5~18質量%含有し、前記溶剤(C)におけるその他溶剤(C3)の含有割合が0~10質量%であり、前記感光性樹脂組成物中に含まれる前記溶剤(C)の含有割合が60質量%未満である、感光性樹脂組成物。
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