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1. WO2020196219 - ELECTRONIC COMPONENT

Publication Number WO/2020/196219
Publication Date 01.10.2020
International Application No. PCT/JP2020/012185
International Filing Date 19.03.2020
IPC
H01L 23/04 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
04characterised by the shape
H03H 9/145 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
02Details
125Driving means, e.g. electrodes, coils
145for networks using surface acoustic waves
H03H 9/25 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
25Constructional features of resonators using surface acoustic waves
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP]
Inventors
  • 野宮 正人 NOMIYA, Masato
Agents
  • 特許業務法人北斗特許事務所 HOKUTO PATENT ATTORNEYS OFFICE
Priority Data
2019-06474128.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELECTRONIC COMPONENT
(FR) COMPOSANT ÉLECTRONIQUE
(JA) 電子部品
Abstract
(EN)
The purpose of the present invention is to increase the degree of wiring design freedom and to prevent a degradation of characteristics. An electronic component (1) is provided with a substrate (2), a first electrode pattern, a second electrode pattern, and a side surface wire (3). The substrate (2) has a first major surface (21), a second major surface (22), and at least one side surface (23 to 26). The side surface wire (3) has a main wire portion (31). The main wire portion (31) is provided on the side surface (23) of the substrate (2). The substrate (2) includes at least the first major surface (21) and the second major surface (22). The side surface wire (3) electrically connects the first electrode pattern and the second electrode pattern.
(FR)
Le but de la présente invention est d'augmenter le degré de liberté de conception de câblage et d'empêcher une dégradation de caractéristiques. Un composant électronique (1) comporte un substrat (2), un premier motif d'électrode, un second motif d'électrode et un fil de surface latérale (3). Le substrat (2) a une première surface principale (21), une seconde surface principale (22) et au moins une surface latérale (23 à 26). Le fil de surface latérale (3) a une partie de fil principal (31). La partie de fil principal (31) est disposée sur la surface latérale (23) du substrat (2). Le substrat (2) comprend au moins la première surface principale (21) et la seconde surface principale (22). Le fil de surface latérale (3) connecte électriquement le premier motif d'électrode et le second motif d'électrode.
(JA)
配線の設計自由度を高め、かつ、特性の劣化を抑制する。電子部品(1)は、基板(2)と、第1電極パターンと、第2電極パターンと、側面配線(3)とを備える。基板(2)は、第1主面(21)と第2主面(22)と少なくとも1つの側面(23~26)とを有する。側面配線(3)は、主配線部(31)を有する。主配線部(31)は、基板(2)の側面(23)に設けられている。基板(2)は、少なくとも第1主面(21)及び第2主面(22)を含む。側面配線(3)は、第1電極パターンと第2電極パターンとを電気的に接続させる。
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