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1. WO2020196130 - FILM ADHESIVE AND SHEET FOR SEMICONDUCTOR PROCESSING

Publication Number WO/2020/196130
Publication Date 01.10.2020
International Application No. PCT/JP2020/011877
International Filing Date 18.03.2020
IPC
C09J 201/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
H01L 21/52 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52Mounting semiconductor bodies in containers
H01L 21/301 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 7/35 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
30characterised by the adhesive composition
35Heat-activated
Applicants
  • リンテック株式会社 LINTEC CORPORATION [JP]/[JP]
Inventors
  • 田中 佑耶 TANAKA Yuya
Agents
  • 西澤 和純 NISHIZAWA Kazuyoshi
  • 五十嵐 光永 IGARASHI Koei
  • 加藤 広之 KATO Hiroyuki
Priority Data
2019-05499622.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) FILM ADHESIVE AND SHEET FOR SEMICONDUCTOR PROCESSING
(FR) ADHÉSIF FORMANT FILM ET FEUILLE POUR TRAITEMENT DE SEMI-CONDUCTEURS
(JA) フィルム状接着剤及び半導体加工用シート
Abstract
(EN)
The present invention relates to a thermosetting film adhesive, wherein, by using a scanning probe microscope: when an area value x1 of a first region that corresponds to a convex section in a binarized image obtained by measuring the surface shape of the film adhesive before thermosetting, and an area value y1 of a second region outside the first region are determined, x1/y1 is 0 to 0.3; and when an area value x2 of a first region and an area value y2 of a second region outside the first region are similarly determined for the film adhesive after thermosetting, x2/y2 is greater than 0.3 and no more than 5.
(FR)
La présente invention concerne un film adhésif thermodurcissable, dans lequel, grâce à l’utilisation d’un microscope à sonde de balayage : lorsqu’une valeur de zone x1 d’une première région qui correspond à une section convexe dans une image binarisée, obtenue par mesure de la forme de surface du film adhésif avant le durcissement à la chaleur, et une valeur de zone y1 d’une seconde région à l’extérieur de la première région sont déterminées, x1/y1 est 0 à 0,3 ; lorsqu’une valeur de zone x2 d’une première région et une valeur de zone y2 d’une seconde région à l’extérieur de la première région sont déterminées de manière similaire pour le film adhésif après le durcissement à la chaleur, x2/y2 est supérieur à 0,3 et non supérieur à 5.
(JA)
本発明は、熱硬化性のフィルム状接着剤であって、走査型プローブ顕微鏡を用いて、熱硬化前の前記フィルム状接着剤の表面形状を測定して得られた二値化処理画像中の凸部に相当する第1領域の面積値xと、前記第1領域以外の第2領域の面積値yと、を求めたとき、x/yが0以上0.3以下であり、前記フィルム状接着剤の熱硬化物について、同様に第1領域の面積値xと、前記第1領域以外の第2領域の面積値yと、を求めたとき、x/yが0.3より大きく、5以下である、フィルム状接着剤に関する。
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