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1. WO2020196112 - ELECTROLESS PLATING BASE FILM

Publication Number WO/2020/196112
Publication Date 01.10.2020
International Application No. PCT/JP2020/011806
International Filing Date 17.03.2020
IPC
C23C 18/30 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, i.e. electroless plating
18Pretreatment of the material to be coated
20of organic surfaces, e.g. resins
28Sensitising or activating
30Activating
B32B 15/095 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
04comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08of synthetic resin
095comprising polyurethanes
C23C 18/38 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, i.e. electroless plating
31Coating with metals
38Coating with copper
H05K 3/18 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
18using precipitation techniques to apply the conductive material
H05K 3/38 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
38Improvement of the adhesion between the insulating substrate and the metal
Applicants
  • 出光興産株式会社 IDEMITSU KOSAN CO.,LTD. [JP]/[JP]
Inventors
  • 蜂屋 聡 HACHIYA, Satoshi
  • 深津 文起 FUKATSU, Fumioki
Agents
  • 特許業務法人平和国際特許事務所 HEIWA INTERNATIONAL PATENT OFFICE
Priority Data
2019-06094327.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELECTROLESS PLATING BASE FILM
(FR) FILM DE BASE DE DÉPÔT AUTOCATALYTIQUE
(JA) 無電解めっき下地膜
Abstract
(EN)
This electroless plating base film contains (A) a conductive polymer and (B) a reactant between a polyisocyanate compound and a polyol resin having a certain acid value, wherein the acid value is 0.1-30 mgKOH/g.
(FR)
Ce film de base de dépôt autocatalytique contient (A) un polymère conducteur et (B) un réactif entre un composé polyisocyanate et une résine polyol ayant un certain indice d'acide, l'indice d'acide étant de 0,1 à 30 mg de KOH/g.
(JA)
(A)導電性ポリマーを含み、さらに、(B)酸価を有するポリオール樹脂とポリイソシアネート化合物との反応物を含み、酸価が0.1mgKOH/g~30mgKOH/gである、無電解めっき下地膜。
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