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1. WO2020195883 - RESIN COMPOSITION FOR SEALING AND SEMICONDUCTOR DEVICE

Publication Number WO/2020/195883
Publication Date 01.10.2020
International Application No. PCT/JP2020/010754
International Filing Date 12.03.2020
IPC
C08G 59/20 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
20characterised by the epoxy compounds used
C08K 5/3472 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
16Nitrogen-containing compounds
34Heterocyclic compounds having nitrogen in the ring
3467having more than two nitrogen atoms in the ring
3472Five-membered rings
C08K 5/54 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
54Silicon-containing compounds
C08L 63/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C08K 3/013 2018.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
01characterised by their specific function
013Fillers, pigments or reinforcing additives
Applicants
  • 住友ベークライト株式会社 SUMITOMO BAKELITE CO., LTD. [JP]/[JP]
Inventors
  • 伊東 昌治 ITO Masaharu
Agents
  • 速水 進治 HAYAMI Shinji
Priority Data
2019-06142727.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) RESIN COMPOSITION FOR SEALING AND SEMICONDUCTOR DEVICE
(FR) COMPOSITION DE RÉSINE POUR SCELLEMENT ET DISPOSITIF SEMI-CONDUCTEUR
(JA) 封止用樹脂組成物および半導体装置
Abstract
(EN)
This resin composition for sealing comprises: at least one compound selected from the group consisting of 3-amino-1,2,4-triazole and 4-amino-1,2,4-triazole as component (A); and an epoxy resin as component (B).
(FR)
Cette composition de résine pour scellement comprend : au moins un composé choisi dans le groupe constitué par le 3-amino-1,2,4-triazole et le 4-amino-1,2,4-triazole en tant que composant (A); et une résine époxy en tant que composant (B).
(JA)
封止用樹脂組成物は、成分(A):3-アミノ-1,2,4-トリアゾールおよび4-アミノ-1,2,4-トリアゾールからなる群から選択される1以上の化合物、および、成分(B):エポキシ樹脂を含む。
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