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1. WO2020195843 - DRY FILM, CURED ARTICLE, AND ELECTRONIC COMPONENT

Publication Number WO/2020/195843
Publication Date 01.10.2020
International Application No. PCT/JP2020/010575
International Filing Date 11.03.2020
IPC
C08J 5/18 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5Manufacture of articles or shaped materials containing macromolecular substances
18Manufacture of films or sheets
C08K 3/00 2018.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
C08K 3/013 2018.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
01characterised by their specific function
013Fillers, pigments or reinforcing additives
C08L 63/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C08L 101/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
G03F 7/004 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
Applicants
  • 太陽インキ製造株式会社 TAIYO INK MFG. CO., LTD. [JP]/[JP]
Inventors
  • 遠藤 新 ENDO Arata
  • 仲田 和貴 NAKADA Kazutaka
Agents
  • 本多 一郎 HONDA Ichiro
Priority Data
2019-05906826.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) DRY FILM, CURED ARTICLE, AND ELECTRONIC COMPONENT
(FR) FILM SEC, ARTICLE DURCI ET COMPOSANT ÉLECTRONIQUE
(JA) ドライフィルム、硬化物、および、電子部品
Abstract
(EN)
A dry film 11 includes a curable resin layer 12 made of a light-shielding curable resin composition containing: a polymer resin having a glass transition point of 20°C or less and a weight average molecular weight of 10,000 or greater; a coloring agent; and an inorganic filler. When the thickness of the curable resin layer 12 is X (μm), the largest particle diameter of aggregate particles of the inorganic filler is X/2 (μm) or less. The dry film 11 has excellent light-shielding performance, and is configured such that warping is suppressed and burrs and chipping during dicing can also be suppressed.
(FR)
L'invention concerne un film sec 11 comprenant une couche de résine durcissable 12 constituée d'une composition de résine durcissable de protection contre la lumière contenant : une résine polymère présentant un point de transition vitreuse de 20°C ou moins et un poids moléculaire moyen en poids de 10.000 ou plus ; un agent colorant ; et une charge inorganique. Lorsque l'épaisseur de la couche de résine durcissable 12 est de X (µm), le plus grand diamètre de particule des particules agrégées de la charge inorganique est de X/2 (µm) ou moins. Le film sec 11 présente d'excellentes performances de protection contre la lumière et est conçu de telle sorte que le gauchissement est supprimé et les bavures et l'écaillage pendant le découpage en dés peuvent également être supprimés.
(JA)
ドライフィルム11は、ガラス転移点が20℃以下かつ重量平均分子量が1万以上の高分子樹脂と、着色剤と、無機フィラーと、を含む遮光性硬化性樹脂組成物からなる硬化性樹脂層12を備える。硬化性樹脂層12の厚さをX(μm)とするとき、無機フィラーの凝集粒の最大粒子径がX/2(μm)以下である。ドライフィルム11は、遮光性に優れ、反りが抑制され、さらに、ダイシングの際のバリや欠けを抑制することができる。
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