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1. WO2020195834 - ELECTRONIC DEVICE

Publication Number WO/2020/195834
Publication Date 01.10.2020
International Application No. PCT/JP2020/010547
International Filing Date 11.03.2020
IPC
H01L 23/29 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
H01L 23/36 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H01L 25/10 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
10the devices having separate containers
H01L 25/11 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
10the devices having separate containers
11the devices being of a type provided for in group H01L29/78
H01L 25/18 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
Applicants
  • 株式会社デンソー DENSO CORPORATION [JP]/[JP]
Inventors
  • 國枝 大佳 KUNIEDA, Hiroyoshi
  • 林 宏樹 HAYASHI, Hiroki
Agents
  • 特許業務法人 サトー国際特許事務所 SATO INTERNATIONAL PATENT FIRM
Priority Data
2019-06331328.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELECTRONIC DEVICE
(FR) DISPOSITIF ÉLECTRONIQUE
(JA) 電子装置
Abstract
(EN)
Provided is an electronic device comprising: an upper package (10) comprising an upper chip (10a); a lower package (12) comprising a lower chip (12a); a printed circuit board (16) comprising the upper package and the lower package stacked on the upper part thereof; and a thermal diffusion layer (26, 30) positioned in the lower package near the lower chip.
(FR)
L'invention concerne un dispositif électronique comprenant : un boîtier supérieur (10) comprenant une puce supérieure (10a) ; un boîtier inférieur (12) comprenant une puce inférieure (12a) ; une carte de circuit imprimé (16) comprenant le boîtier supérieur et le boîtier inférieur empilés sur la partie supérieure de celui-ci ; et une couche de diffusion thermique (26, 30) positionnée dans le boîtier inférieur à proximité de la puce inférieure.
(JA)
電子装置は、上チップ(10a)を備える上パッケージ(10)と、下チップ(12a)を備える下パッケージ(12)と、前記上パッケージ、及び前記下パッケージを上部に積層して備えるプリント基板(16)と、前記下パッケージにおいて、下チップの近傍に配置される熱拡散層(26、30)と、を備える。
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