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1. WO2020195804 - PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED OBJECT, AND ELECTRONIC COMPONENT

Publication Number WO/2020/195804
Publication Date 01.10.2020
International Application No. PCT/JP2020/010391
International Filing Date 10.03.2020
IPC
C08G 73/22 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
22Polybenzoxazoles
G03F 7/004 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/023 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
022Quinonediazides
023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
Applicants
  • 太陽ホールディングス株式会社 TAIYO HOLDINGS CO., LTD. [JP]/[JP]
Inventors
  • イム ヨンジョン LIM, YeonJeong
  • 秋元 真歩 AKIMOTO, Maho
Agents
  • 伊藤 温 ITOH, Atsushi
Priority Data
2019-05523722.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED OBJECT, AND ELECTRONIC COMPONENT
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, FILM SEC, PRODUIT DURCI, ET COMPOSANT ÉLECTRONIQUE
(JA) 感光性樹脂組成物、ドライフィルム、硬化物、及び、電子部品
Abstract
(EN)
[Problem] To provide: a photosensitive resin composition which can be photocured without leaving any photocuring failure in the cured photosensitive resin composition (has excellent photocurability (in inner portions)) and which, when used as an insulating film for WLP rewiring, has hiding properties to such a degree that the wiring circuit patterns on the silicon wafer cannot be visually recognized, and in which very little internal stress occurs upon curing shrinkage; a dry film; a cured object; and an electronic component. [Solution] A photosensitive resin composition which comprises (A) a polybenzoxazole precursor, (B) a photosensitizer, and (C) an organic pigment, the organic pigment (C) being contained in an amount of 0.1-30 parts by mass per 100 parts by mass of the polybenzoxazole precursor (A), characterized by giving a cured film which has an internal stress of 20 MPa or less.
(FR)
La présente invention vise à fournir une composition de résine photosensible qui peut être photodurcie sans laisser de défaillance de photopolymérisation dans la composition de résine photosensible durcie (ayant une excellente photodurcissabilité (dans des parties internes)) et qui, lorsqu'elle est utilisée en tant que film isolant pour recâblage de WLP, a des propriétés de dissimulation à un degré tel que les motifs de circuit de câblage sur la tranche de silicium ne peuvent pas être reconnus visuellement, et dans lequel une très faible contrainte interne se produit lors du retrait de durcissement ; un film sec ; un objet durci ; et un composant électronique. L'invention concerne par conséquent une composition de résine photosensible qui comprend (A) un précurseur de polybenzoxazole, (B) un photosensibilisateur, et (C) un pigment organique, le pigment organique (C) étant contenu en une quantité de 0,1 à 30 parties en masse pour 100 parties en masse du précurseur de polybenzoxazole (A), caractérisé en ce qu'il donne un film durci qui a une contrainte interne de 20 MPa ou moins.
(JA)
【課題】 硬化後の感光性樹脂組成物が、感光不良を起こすことなく感光することができ((深部)感光性に優れ)、かつ、WLPの再配線用の絶縁膜として用いた場合に、シリコンウエハ上の配線回路パターンを視認できない程度に隠蔽性を有し、硬化収縮時の内部応力が極めて少ない感光性樹脂組成物と、ドライフィルム、硬化物、電子部品を提供する。 【解決手段】 (A)ポリベンゾオキサゾール前駆体、(B)感光剤、(C)有機顔料を含み、前記(C)有機顔料の配合量は、前記(A)ポリベンゾオキサゾール前駆体の配合量を100質量部とした場合に、0.1~30質量部で感光性樹脂組成物であって、前記感光性樹脂組成物からなる硬化膜の内部応力が20MPa以下であることを特徴とする、感光性樹脂組成物。
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