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1. WO2020195341 - DILUTE CHEMICAL SOLUTION PRODUCTION DEVICE

Publication Number WO/2020/195341
Publication Date 01.10.2020
International Application No. PCT/JP2020/006171
International Filing Date 18.02.2020
IPC
B01F 1/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
FMIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING
1Dissolving
B01F 3/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
FMIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING
3Mixing, e.g. dispersing, emulsifying, according to the phases to be mixed
08liquids with liquids; Emulsifying
B01F 5/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
FMIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING
5Flow mixers; Mixers for falling materials, e.g. solid particles
B01F 15/04 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
FMIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING
15Accessories for mixers
04Forming a predetermined ratio of the substances to be mixed
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
CPC
B01F 1/00
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
FMIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING
1Dissolving
B01F 15/04
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
FMIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING
15Accessories for mixers ; ; Auxiliary operations or auxiliary devices; Parts or details of general application
04Forming a predetermined ratio of the substances to be mixed
B01F 3/08
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
FMIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING
3Mixing, e.g. dispersing, emulsifying, according to the phases to be mixed
08liquids with liquids; Emulsifying
B01F 5/00
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
FMIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING
5Flow mixers
H01L 21/304
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
302to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
Applicants
  • 栗田工業株式会社 KURITA WATER INDUSTRIES LTD. [JP]/[JP]
Inventors
  • 杉田 航 SUGITA Wataru
  • 小川 祐一 OGAWA Yuichi
Agents
  • 早川 裕司 HAYAKAWA Yuzi
  • 村雨 圭介 MURASAME Keisuke
Priority Data
2019-06357428.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) DILUTE CHEMICAL SOLUTION PRODUCTION DEVICE
(FR) DISPOSITIF DE PRODUCTION DE SOLUTION CHIMIQUE DILUÉE
(JA) 希薄薬液製造装置
Abstract
(EN)
A dilute chemical solution production device 1 that has a plunger pump and a chemical solution supply pipe 3 that supply a chemical solution S from a chemical solution storage tank. The terminus of the chemical solution supply pipe 3 is an injection point 11 for the chemical solution S. The chemical solution supply pipe 3 is inserted into first piping that is an ultrapure water passage 12 to approximately the center thereof in the radial direction via a bore-through joint 13. A conductivity meter 14 is provided as a conductivity measurement means downstream of the bore-through joint 13, which is the injection point 11, and is connected to a control means (not shown), and the plunger pump 4 can be controlled in accordance with measured values from the conductivity meter 14. This dilute chemical solution production device makes it possible to stably produce a dilute chemical solution that has an extremely low concentration of acid/base or the like by means of a simple structure.
(FR)
L'invention concerne un dispositif de production de solution chimique diluée 1 qui comprend une pompe à piston et un tuyau d'alimentation en solution chimique 3 qui fournissent une solution chimique S à partir d'un réservoir de stockage de solution chimique. La terminaison du tuyau d'alimentation en solution chimique 3 est un point d'injection 11 pour la solution chimique S. Le tuyau d'alimentation en solution chimique 3 est inséré dans une première tuyauterie qui est un passage d'eau ultra-pure 12 à approximativement le centre de celle-ci dans la direction radiale par l'intermédiaire d'un joint d'alésage traversant 13. Un dispositif de mesure de conductivité 14 est utilisé en tant que moyen de mesure de conductivité en aval du joint d'alésage traversant 13, qui est le point d'injection 11, et est connecté à un moyen de commande (non représenté), et la pompe à piston 4 peut être commandée en fonction de valeurs mesurées provenant du dispositif de mesure de conductivité 14. Ce dispositif de production de solution chimique diluée permet de produire de manière stable une solution chimique diluée qui présente une concentration extrêmement faible en acide/base ou analogue au moyen d'une structure simple.
(JA)
希薄薬液製造装置1は、薬液貯槽から薬液Sを供給するプランジャポンプと薬液供給管3とを有する。薬液供給管3の末端は薬液Sの注入点11となっている。この薬液供給管3は、ボアスルー継手13を介して第1の配管である超純水流路12の径方向の略中央にまで挿入されている。そして、注入点11となるボアスルー継手13より下流側には、導電率計測手段としての導電率計14が設けられていて、前述した制御手段(図示せず)に接続しており、導電率計14の測定値に応じてプランジャポンプ4を制御可能となっている。このような希薄薬液製造装置であれば、簡単な構造で酸・アルカリ等の極めて低濃度の希薄薬液を安定的に製造することができる。
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