Processing

Please wait...

PATENTSCOPE will be unavailable a few hours for maintenance reason on Saturday 31.10.2020 at 7:00 AM CET
Settings

Settings

Goto Application

1. WO2020195175 - SUBSTRATE PROCESSING DEVICE AND TRANSFER CONTROL METHOD THEREFOR

Publication Number WO/2020/195175
Publication Date 01.10.2020
International Application No. PCT/JP2020/004018
International Filing Date 04.02.2020
IPC
H01L 21/027 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/306 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
306Chemical or electrical treatment, e.g. electrolytic etching
H01L 21/677 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677for conveying, e.g. between different work stations
Applicants
  • 株式会社SCREENホールディングス SCREEN HOLDINGS CO., LTD. [JP]/[JP]
Inventors
  • 河原 啓之 KAWAHARA, Hiroyuki
  • 橋本 光治 HASHIMOTO, Koji
  • 菊本 憲幸 KIKUMOTO, Noriyuki
  • 墨 周武 SUMI, Noritake
Agents
  • 振角 正一 FURIKADO, Shoichi
  • 大西 一正 OHNISHI, Kazumasa
Priority Data
2019-05873426.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SUBSTRATE PROCESSING DEVICE AND TRANSFER CONTROL METHOD THEREFOR
(FR) DISPOSITIF DE TRAITEMENT DE SUBSTRAT ET SON PROCÉDÉ DE COMMANDE DE TRANSFERT
(JA) 基板処理装置およびその搬送制御方法
Abstract
(EN)
A substrate processing device 1 which transfers a substrate with a substrate surface coated with a liquid film is provided with: a first processing unit 11A which, in order to prevent exposure of the substrate surface due to vibrations, evaporation of liquid and the like during transfer, supplies a liquid to the substrate S and coats the substrate surface with a liquid film; a transfer mechanism 15 which transfers the substrate carrying the liquid film; a second processing unit 13A which receives the substrate transferred by the transfer mechanism and performs a predetermined process; an image capture unit 157 which captures an image of the liquid film formed on the substrate surface; and a control unit 90 which controls the operation of the transfer mechanism on the basis of a difference between a plurality of images captured by the image capture unit at mutually different times between when the liquid film was formed and when the substrate is loaded into the second processing unit by the transfer mechanism.
(FR)
L'invention concerne un dispositif de traitement de substrat 1 qui transfère un substrat doté d'une surface de substrat revêtue d'un film liquide, comprenant : une première unité de traitement 11A qui, afin d'empêcher une exposition de la surface de substrat en raison de vibrations, une évaporation du liquide, et analogue, pendant le transfert, fournit un liquide au substrat S et couvre la surface de substrat d'un film liquide ; un mécanisme de transfert 15 qui transfère le substrat portant le film liquide ; une seconde unité de traitement 13A qui reçoit le substrat transféré par le mécanisme de transfert et qui exécute un traitement prédéfini ; une unité de capture d'image 157 qui capture une image du film liquide formé sur la surface de substrat ; et une unité de commande 90 qui commande le fonctionnement du mécanisme de transfert sur la base d'une différence entre des images d'une pluralité d'images capturées par l'unité de capture d'image à des instants mutuellement différents entre la formation du film liquide et le chargement du substrat dans la seconde unité de traitement par le mécanisme de transfert.
(JA)
基板表面を液膜で覆った状態で基板を搬送する基板処理装置1は、搬送中の振動や液体の揮発等に起因する基板表面の露出を防止するために、基板Sに液体を供給して基板の表面を液膜で覆う第1処理部11Aと、液膜を担持する基板を搬送する搬送機構15と、搬送機構により搬送される基板を受け入れて所定の処理を実行する第2処理部13Aと、基板の表面に形成された液膜を撮像する撮像部157と、液膜が形成されてから搬送機構により基板が第2処理部へ搬入されるまでの間の互いに異なる時刻にそれぞれ撮像部により撮像された複数の画像の差に基づき、搬送機構の動作を制御する制御部90とを備えている。
Latest bibliographic data on file with the International Bureau