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1. WO2020194920 - THERMOSETTING EPOXY RESIN COMPOSITION, LAYERED SHEET FOR CIRCUIT BOARD, METAL-BASED CIRCUIT BOARD, AND POWER MODULE

Publication Number WO/2020/194920
Publication Date 01.10.2020
International Application No. PCT/JP2019/049473
International Filing Date 17.12.2019
IPC
C08G 59/56 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40characterised by the curing agents used
50Amines
56together with other curing agents
C08L 63/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
B32B 15/092 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
04comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08of synthetic resin
092comprising epoxy resins
C08K 3/013 2018.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
01characterised by their specific function
013Fillers, pigments or reinforcing additives
H05K 1/03 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
H05K 1/05 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
05Insulated metal substrate
Applicants
  • 日本発條株式会社 NHK SPRING CO., LTD. [JP]/[JP]
Inventors
  • 水野 克美 MIZUNO, Katsumi
  • 川崎 明日香 KAWASAKI, Asuka
Agents
  • 蔵田 昌俊 KURATA, Masatoshi
  • 野河 信久 NOGAWA, Nobuhisa
  • 井上 正 INOUE, Tadashi
  • 河野 直樹 KOHNO, Naoki
Priority Data
2019-06022627.03.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) THERMOSETTING EPOXY RESIN COMPOSITION, LAYERED SHEET FOR CIRCUIT BOARD, METAL-BASED CIRCUIT BOARD, AND POWER MODULE
(FR) COMPOSITION DE RÉSINE ÉPOXY THERMODURCISSABLE, FEUILLE STRATIFIÉE DESTINÉE À UNE CARTE DE CIRCUIT IMPRIMÉ, CARTE DE CIRCUIT IMPRIMÉ À BASE DE MÉTAL ET MODULE DE COURANT
(JA) 熱硬化性エポキシ樹脂組成物、回路基板用積層板、金属ベース回路基板、およびパワーモジュール
Abstract
(EN)
According to one embodiment, provided is a thermosetting resin composition containing an epoxy resin, an aromatic amine compound, a boron-phosphorus complex and a phosphorus compound. The aromatic amine compound is represented by general formula (1) (where R1 is an alkyl group; m is an integer of 2 or greater, n is an integer of 0 or greater, and m and n satisfy m + n < 6; and when n is an integer of 2 or greater, each of the multiple R1 can be the same or different).
(FR)
Selon un mode de réalisation, l'invention concerne une composition de résine thermodurcissable contenant une résine époxy, un composé amine aromatique, un complexe bore-phosphore et un composé phosphoreux. Le composé amine aromatique est représenté par la formule générale (1) (où R1 est un groupe alkyle ; m est un entier supérieur ou égal à 2, n est un entier supérieur ou égal à 0, et m et n satisfont à m + n < 6 ; et lorsque n est un entier supérieur ou égal à 2, chacun des multiples R1 peut être identique ou différent).
(JA)
本実施形態により、エポキシ樹脂と芳香族アミン化合物とホウ素-リン錯体とリン化合物を含有する熱硬化性樹脂組成物が提供される。上記芳香族アミン化合物は、下記一般式(1)で表される。(式中、Rはアルキル基を表し、mは2以上の整数を表し、nは0以上の整数を表し、且つ、mとnはm+n≦6を満たす。nが2以上の整数のとき、複数存在するRは、互いに同一でもよく異なっていてもよい。)
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