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1. WO2020194625 - LASER DEVICE AND LASER PROCESSING APPARATUS

Publication Number WO/2020/194625
Publication Date 01.10.2020
International Application No. PCT/JP2019/013445
International Filing Date 27.03.2019
IPC
H01S 5/062 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
06Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
062by varying the potential of the electrodes
B23K 26/00 2014.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
B23K 26/38 2014.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
38by boring or cutting
Applicants
  • 三菱電機株式会社 MITSUBISHI ELECTRIC CORPORATION [JP]/[JP]
Inventors
  • 京藤 友博 KYOTO, Tomohiro
Agents
  • 高村 順 TAKAMURA, Jun
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LASER DEVICE AND LASER PROCESSING APPARATUS
(FR) DISPOSITIF LASER ET APPAREIL DE TRAITEMENT LASER
(JA) レーザ装置およびレーザ加工機
Abstract
(EN)
The present invention provides a laser device (100) provided with: a plurality of laser diodes (1, 2-1, 2-2, 2-n); a first power source (3), which is a power source for supplying electrical power to a first laser diode (1), which is at least one of the plurality of laser diodes (1, 2-1, 2-2, 2-n); a second power source (4), which is a power source for supplying electrical power to second laser diodes (2-1, 2-2, 2-n), which are laser diodes from among the laser diodes (1, 2-1, 2-2, 2-n) other than the first laser diode (1); and a control device (5) for controlling the first power source (3) and the second power source (4). The second power source (4) is a power source having a specification compatible with an output power higher than that of the first power source (3).
(FR)
La présente invention concerne un dispositif laser (100) comprenant : une pluralité de diodes laser (LD) (1, 2-1, 2-2, 2-n); une première source d'alimentation (3), qui est une source d'alimentation destinée à fournir de l'énergie électrique à une première diode laser (1), qui est au moins une diode laser de la pluralité de diodes laser (1, 2-1, 2-2, 2-n); une seconde source d'alimentation (4), qui est une source d'alimentation destinée à fournir de l'énergie électrique à des secondes diodes laser (2-1, 2-2, 2-n), qui sont des diodes laser, parmi les diodes laser (1, 2-1, 2-2, 2-n), autres que la première diode laser (1); et un dispositif de commande (5) destiné à commander la première source d'alimentation (3) et la seconde source d'alimentation (4). La seconde source d'alimentation (4) est une source d'alimentation ayant une spécification compatible avec une puissance de sortie supérieure à celle de la première source d'alimentation (3).
(JA)
レーザ装置(100)は、複数のレーザダイオード(1,2-1,2-2,2-n)と、複数のレーザダイオード(1,2-1,2-2,2-n)のうちの少なくとも1つである第一レーザダイオード(1)へ電力を供給する電源である第一電源(3)と、複数のレーザダイオード(1,2-1,2-2,2-n)のうち第一レーザダイオード(1)以外のレーザダイオードである第二レーザダイオード(2-1,2-2,2-n)へ電力を供給する電源である第二電源(4)と、第一電源(3)と第二電源(4)とを制御する制御装置(5)と、を備える。第二電源(4)は、第一電源(3)よりも高い出力パワーに対応した仕様の電源である。
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