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1. WO2020194394 - CIRCUIT SHEET, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CIRCUIT SHEET, AND METHOD FOR MANUFACTURING CIRCUIT BOARD

Publication Number WO/2020/194394
Publication Date 01.10.2020
International Application No. PCT/JP2019/012191
International Filing Date 22.03.2019
IPC
H05K 3/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
H05K 3/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
20by affixing prefabricated conductor pattern
Applicants
  • 日立化成株式会社 HITACHI CHEMICAL COMPANY, LTD. [JP]/[JP]
Inventors
  • 濱上 弘行 HAMAGAMI, Hiroyuki
  • 戸川 光生 TOGAWA, Mitsuo
  • 天童 一良 TENDOU, Kazuyoshi
Agents
  • 特許業務法人太陽国際特許事務所 TAIYO, NAKAJIMA & KATO
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CIRCUIT SHEET, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CIRCUIT SHEET, AND METHOD FOR MANUFACTURING CIRCUIT BOARD
(FR) FEUILLE DE CIRCUIT, CARTE DE CIRCUIT IMPRIMÉ, DISPOSITIF À SEMI-CONDUCTEUR, PROCÉDÉ DE FABRICATION DE FEUILLE DE CIRCUIT ET PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT IMPRIMÉ
(JA) 回路シート、回路基板、半導体装置、回路シートの製造方法、及び回路基板の製造方法
Abstract
(EN)
A circuit sheet (11) includes: a first circuit (1) having a first average thickness and a first circuit pitch; a second circuit (2) having a second average thickness which is thinner than the first average thickness, and a circuit pitch; and a resin (3) filling in a space between the first circuit and the second circuit.
(FR)
Une feuille de circuit (11) comprend : un premier circuit (1) ayant une première épaisseur moyenne et un premier pas de circuit ; un second circuit (2) ayant une seconde épaisseur moyenne qui est plus mince que la première épaisseur moyenne, et un pas de circuit ; et une résine (3) remplissant un espace entre le premier circuit et le second circuit.
(JA)
回路シート(11)は、第1の平均厚みを有し、第1の回路ピッチを有する第1の回路(1)と、前記第1の平均厚みより小さい第2の平均厚みを有し、回路ピッチを有する第2の回路(2)と、前記第1の回路と前記第2の回路との間の空間に充填されている樹脂(3)と、を含む。
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