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1. WO2020194310 - SEMICONDUCTOR FLIPPER

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[ EN ]

WHAT IS CLAIMED IS:

1. A wafer flipping method for use in semiconductor processing of semiconductor work products of a plurality of predetermined sizes, the method comprising:

receiving a semiconductor work product of a first predetermined size in a rotating assembly when in a first unrotated position, the rotating assembly having a plurality of retractable pins each corresponding to a respective predetermined size;

gripping the semiconductor work product in the assembly at a first rotation position;

selecting retractable pin from the plurality of alignment retractable corresponding to said first predetermined size;

aligning the semiconductor work product in the assembly using said selected retractable pin;

rotating the assembly with the semiconductor work product thereon into a second, rotated, position;

releasing the semiconductor work product from said second, rotated, position.

2. The wafer flipping method of claim 1, comprising gripping said semiconductor work product between a first gripping frame and a second gripping frame.

3. The wafer flipping method of claim 1 or claim 2, receiving pneumatic power from a support into said rotating assembly and supplying said pneumatic power to said gripper.

4. The wafer flipping method of claim 3, comprising using a rotary joint with respective feed and return connections to provide a pneumatic circuit.

5. The wafer flipping method of any one of claims 1 to 4, comprising using a slip ring for supplying electrical power from a support to said assembly.

6. The wafer flipping method of claim 1, comprising pushing the semiconductor work product using a plunger pin against respective extended alignment pins of said retractable pins to align said work product.

7. The wafer flipping method of claim 6, comprising operating said alignment pins via solenoids.

8. The wafer flipping method of claim 7, wherein the solenoids are powered through a slip ring from at least one electronic controller mounted outside said rotating assembly.

9. The wafer flipping method of any one of the preceding claims, wherein said second position is rotated by up to a hundred and eighty degrees from said first position.

10. The wafer flipping method of any one of the preceding claims wherein the semiconductor work product is a wafer or a ring.

11. The wafer flipping method of any one of the preceding claims, comprising operating a release actuator for releasing said semiconductor work product from said gripper when in said second rotated position, said semiconductor work product thereby being released in a predetermined alignment at said second rotated position.

12. A wafer flipping device for use in semiconductor processing of semiconductor work products of a plurality of different predetermined sizes, the device comprising a supported rotating assembly, the rotating assembly comprising:

a gripper for receiving said semiconductor work product;

upper and lower frame parts for gripping said semiconductor work product within said frame while said semiconductor work products is oriented in a first orientation;

retractable pins for bringing the semiconductor work product into a predetermined alignment within said frame, the retractable pins being selectable for different ones of said predetermined sizes, thereby to provide alignments for all of said predetermined sizes;

a rotation actuator for rotating said rotating assembly between said first orientation and a second orientation rotated from said first orientation; and

a release actuator for releasing said frame parts to release said semiconductor work product into a predetermined alignment when in said second orientation.

13. The wafer flipping device of claim 12, wherein said rotating assembly comprises a rotary joint for receiving pneumatic power from a support for supply to each of said frame parts.

14. The wafer flipping device of claim 13, wherein said rotary joint is located on a rotation axis of said rotating assembly.

15. The wafer flipping device of any one of claims 12 to 14, wherein said rotating assembly comprises a slip ring for supplying electrical power from a support to said assembly.

16. The wafer flipping device of any one of claims 12 to 15, wherein alignment pins of said retractable pins are for aligning semiconductor work products of respective ones of a plurality of different sizes or shapes, each size or shape having a respective predetermined alignment.

17. The wafer flipping device of claim 16, wherein said alignment pins are operated via at least one electronic controller mounted outside said rotating assembly, and/or wherein said frame parts are operated via at least one electronic controller mounted outside said rotating assembly.

18. The wafer flipping device of claim 17, wherein said at least one electronic controller is connected to power said alignment pins or said frame parts.

19. The wafer flipping device of claim 18, wherein said alignment pins or said frame parts are powered via a slip-ring.

20. The wafer flipping device of any one of claims 12 to 19, wherein said retractable pins are provided in pairs, and at least one of each pair of said alignment pins comprises an alignment pin.

21. The wafer flipping device of any one of claims 12 to 20, comprising a pneumatic distribution system for distributing pneumatic fluid from said rotary valve to respective ones of said gripper frame parts.

22. The wafer flipping device of any one of claims 12 to 21, wherein said second orientation is rotated by a hundred and eighty degrees from said first orientation.

23. The wafer flipping device of any one of claims 12 to 22, wherein the semiconductor work product is a wafer or a ring.

24. A wafer flipping device for use in semiconductor processing, comprising a support comprising an electrical power supply and a pneumatic source;

a rotating assembly;

a slip ring connecting the power supply to the rotating assembly; and

a rotary joint configured to mount the rotating assembly on the support and to provide a feed and return to connect said pneumatic source to said rotating assembly.