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1. WO2020193461 - DETACHABLE ADHESIVE STRIP

Publication Number WO/2020/193461
Publication Date 01.10.2020
International Application No. PCT/EP2020/057941
International Filing Date 23.03.2020
IPC
C01B 33/113 2006.01
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF
33Silicon; Compounds thereof
113Silicon oxides; Hydrates thereof
C08K 7/26 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7Use of ingredients characterised by shape
22Expanded, porous or hollow particles
24inorganic
26Silicon-containing compounds
C09J 7/00 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
C09J 11/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
C09J 133/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
133Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
C09J 151/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
151Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
CPC
C01B 33/113
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; ; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
33Silicon; Compounds thereof
113Silicon oxides; Hydrates thereof
C01P 2004/32
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
2004Particle morphology
30extending in three dimensions
32Spheres
C01P 2004/52
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
2004Particle morphology
51Particles with a specific particle size distribution
52highly monodisperse size distribution
C01P 2004/54
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
2004Particle morphology
54Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
C01P 2004/60
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
2004Particle morphology
60Particles characterised by their size
C01P 2006/12
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
2006Physical properties of inorganic compounds
12Surface area
Applicants
  • TESA SE [DE]/[DE]
Inventors
  • MAYER, Michael
  • PÖHLS, Jan Ole
  • SCHUBERT, Thomas
Priority Data
10 2019 204 344.528.03.2019DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) WIEDERABLÖSBARER HAFTKLEBESTREIFEN
(EN) DETACHABLE ADHESIVE STRIP
(FR) BANDE ADHÉSIVE DE CONTACT DÉTACHABLE
Abstract
(DE)
Die vorliegende Erfindung betrifft einen Haftklebestreifen, der sich durch dehnendes Verstrecken im Wesentlichen in der Verklebungsebene rückstands- und zerstörungsfrei wieder ablösen lässt, aus ein oder mehreren Haftklebemassenschichten und gegebenenfalls ein oder mehreren Zwischenträgerschichten, wobei mindestens eine der Haftklebemassenschichten mindestens einen in seine Primärpartikel vereinzelbaren Füllstoff enthält, wobei die Primärpartikel (i) im Wesentlichen sphärisch sind und (ii) einen mittleren Durchmesser d(0,5) von weniger als 10 μm aufweisen, und wobei das Verhältnis aus mittlerem Durchmesser d(0,5) der Primärpartikel zur Dicke der Haftklebemassenschicht, in der die Primärpartikel enthalten sind, weniger als 1:2 beträgt, sowie dessen Herstellung und Verwendung.
(EN)
The invention relates to an adhesive strip which can be detached substantially on the adhesion plane in a residue-free and nondestructive manner by stretching, said strip consisting of one or more adhesive material layers and optionally one or more intermediate carrier layers, at least one of the adhesive materials layers containing at least one filler, the primary particles of which can be individually separated, wherein the primary particles (i) are substantially spherical and (ii) have an average diameter d(0.5) of less than 10 µm, and the ratio of the average diameter d(0.5) of the primary particles to the thickness of the adhesive material layer in which the primary particles are contained is less than 1:2. The invention also relates to the production and use of said adhesive strip.
(FR)
La présente invention concerne une bande adhésive de contact qui peut être détachée sans résidus et sans destruction par étirage d'extension sensiblement dans le plan de collage et qui est constituée d'une ou de plusieurs couches adhésives de contact et éventuellement d'une ou de plusieurs couches de support intermédiaires, au moins une des couches adhésives de contact contenant au moins une matière de charge pouvant être séparée en ses particules primaires, les particules primaires (i) étant sensiblement sphériques et (ii) présentant un diamètre d(0,5) de moins de 10 μm, le rapport entre le diamètre moyen d(0,5) des particules primaires et l'épaisseur de la couche adhésive de contact, dans laquelle sont contenues les particules primaires, étant de moins de 1:2, ainsi que sa fabrication et son utilisation.
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